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KM718V990T-85000 PDF预览

KM718V990T-85000

更新时间: 2024-11-14 14:51:55
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
17页 466K
描述
Cache SRAM, 512KX18, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

KM718V990T-85000 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
Is Samacsys:N最长访问时间:4.2 ns
JESD-30 代码:R-PQFP-G100长度:20 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:18功能数量:1
端子数量:100字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

KM718V990T-85000 数据手册

 浏览型号KM718V990T-85000的Datasheet PDF文件第2页浏览型号KM718V990T-85000的Datasheet PDF文件第3页浏览型号KM718V990T-85000的Datasheet PDF文件第4页浏览型号KM718V990T-85000的Datasheet PDF文件第5页浏览型号KM718V990T-85000的Datasheet PDF文件第6页浏览型号KM718V990T-85000的Datasheet PDF文件第7页 
KM736V890  
KM718V990  
256Kx36 & 512Kx18 Synchronous SRAM  
Document Title  
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM  
Revision History  
Draft Date  
Rev. No.  
History  
Remark  
May. 07 . 1998  
June .08. 1998  
Preliminary  
Preliminary  
0.0  
0.1  
Initial draft  
Modify DC characteristics( Input Leakage Current test Conditions)  
form VDD=VSS to VDD to Max.  
Aug. 20. 1998 Preliminary  
Aug. 27. 1998 Preliminary  
0.2  
0.3  
Remove 119BGA Package Type.  
Change DC Characteristics.  
ISB value from 65mA to 110mA at -72  
ISB value from 60mA to 110mA at -85  
ISB value from 50mA to 100mA at -10  
ISB1 value from 10mA to 30mA  
ISB2 value from 10mA to 30mA  
Sep. 09. 1998 Preliminary  
0.4  
1. Changed tCD from 4.0ns to 4.2ns at -85.  
Changed tOE from 4.0ns to 4.2ns at -85.  
2. Changed DC condition at Icc and parameters  
Icc ; from 375mA to 400mA at -72,  
from 340mA to 380mA at -85,  
from 300mA to 350mA at -10,  
ISB ; from 110mA to 130mA at -72,  
from 110mA to 130mA at -85,  
from 100mA to 120mA at -10  
Dec. 10. 1998  
Dec. 23. 1998  
Jan. 29. 1999  
Feb. 25. 1999  
May. 13. 1999  
Preliminary  
Preliminary  
Final  
0.5  
0.6  
1.0  
2.0  
3.0  
ADD VDDQ Supply voltage( 2.5V )  
Changed VOL Max value from 0.2V to 0.4V at 2.5V I/O.  
Final spec Release.  
Final  
1. Remove VDDQ Supply voltage( 2.5V I/O )  
1. Add VDDQ Supply voltage( 2.5V I/O )  
Final  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
- 1 -  
May 1999  
Rev 3.0  

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