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K9T1G08U0M-FIB00 PDF预览

K9T1G08U0M-FIB00

更新时间: 2024-11-25 14:51:51
品牌 Logo 应用领域
三星 - SAMSUNG ISM频段光电二极管内存集成电路
页数 文件大小 规格书
38页 885K
描述
Flash, 128MX8, 30ns, PDSO48, 12 X 17 MM, 0.70 MM PITCH, LEAD FREE, PLASTIC, WSOP1-48

K9T1G08U0M-FIB00 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:VSSOP,
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.84最长访问时间:30 ns
其他特性:CONTAINS ADDITIONAL 32M BIT SPARE MEMORYJESD-30 代码:R-PDSO-G48
JESD-609代码:e6长度:15.4 mm
内存密度:1073741824 bit内存集成电路类型:FLASH
内存宽度:8湿度敏感等级:3
功能数量:1端子数量:48
字数:134217728 words字数代码:128000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:128MX8
封装主体材料:PLASTIC/EPOXY封装代码:VSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
编程电压:2.7 V认证状态:Not Qualified
座面最大高度:0.7 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN BISMUTH
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NAND TYPE宽度:12 mm
Base Number Matches:1

K9T1G08U0M-FIB00 数据手册

 浏览型号K9T1G08U0M-FIB00的Datasheet PDF文件第2页浏览型号K9T1G08U0M-FIB00的Datasheet PDF文件第3页浏览型号K9T1G08U0M-FIB00的Datasheet PDF文件第4页浏览型号K9T1G08U0M-FIB00的Datasheet PDF文件第5页浏览型号K9T1G08U0M-FIB00的Datasheet PDF文件第6页浏览型号K9T1G08U0M-FIB00的Datasheet PDF文件第7页 
FLASH MEMORY  
K9T1G08U0M  
Document Title  
128M x 8 Bits NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
0.2  
0.3  
Aug. 7th 2003  
Oct. 20th 2003  
Mar. 9th 2004  
Apr. 24th 2004  
Advanced  
Initial issue.  
tR is changed. [Old : 12µs(Max.), New :15µs(Max.)]  
CE must be held low during tR added.  
Preliminary  
Preliminary  
Preliminary  
Preliminary  
Preliminary  
Final  
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.  
1. PKG(TSOP1, WSOP1) Dimension Change  
1. Technical note is changed  
0.4  
0.5  
1.0  
May. 24th 2004  
Oct. 25th 2004  
May 6th 2005  
1. The flow chart to creat the initial invalid block table is chacged.  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.samsung.com/Products/Semiconductor/  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
1

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