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K9K1G08B0B-GCB00 PDF预览

K9K1G08B0B-GCB00

更新时间: 2024-11-30 14:43:03
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路
页数 文件大小 规格书
41页 1073K
描述
Flash, 128MX8, 30ns, PBGA63, FBGA-63

K9K1G08B0B-GCB00 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:FBGA-63针数:63
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.91
最长访问时间:30 ns命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PBGA-B63
长度:13.5 mm内存密度:1073741824 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:8K
端子数量:63字数:134217728 words
字数代码:128000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128MX8封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA63,10X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
页面大小:512 words并行/串行:PARALLEL
电源:2.7 V编程电压:2.7 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:16K
最大待机电流:0.00005 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):2.9 V
最小供电电压 (Vsup):2.5 V标称供电电压 (Vsup):2.7 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
切换位:NO类型:SLC NAND TYPE
宽度:8.5 mmBase Number Matches:1

K9K1G08B0B-GCB00 数据手册

 浏览型号K9K1G08B0B-GCB00的Datasheet PDF文件第2页浏览型号K9K1G08B0B-GCB00的Datasheet PDF文件第3页浏览型号K9K1G08B0B-GCB00的Datasheet PDF文件第4页浏览型号K9K1G08B0B-GCB00的Datasheet PDF文件第5页浏览型号K9K1G08B0B-GCB00的Datasheet PDF文件第6页浏览型号K9K1G08B0B-GCB00的Datasheet PDF文件第7页 
K9K1G08R0B  
K9K1G08B0B  
K9K1G08U0B  
FLASH MEMORY  
Document Title  
128M x 8 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
Initial issue.  
Mar. 17th 2003 Advance  
Oct. 11th 2004 Advance  
1. Note 1 ( Program/Erase Characteristics) is added( page 13 )  
2. NAND Flash Technical Notes is changed.  
-Invalid block -> initial invalid block ( page 15 )  
-Error in write or read operation ( page 16 )  
-Program Flow Chart ( page 16 )  
3. Vcc range is changed  
-1.7V~1.95V ->1.65V~1.95V  
4. 2.7V device is added  
5. Multi plane operation and Copy-Back Program are not supported with 1.8V  
device.  
1. The flow chart to creat the initial invalid block table is changed.  
0.2  
1.0  
May 6th. 2005 Preliminary  
May 30th 2005  
Final  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near your office.  
1

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