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K4T51083QB-GCCC PDF预览

K4T51083QB-GCCC

更新时间: 2024-11-23 22:14:39
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
28页 591K
描述
512Mb B-die DDR2 SDRAM

K4T51083QB-GCCC 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete包装说明:FBGA, BGA60,9X11,32
Reach Compliance Code:compliant风险等级:5.92
Is Samacsys:N最长访问时间:0.6 ns
最大时钟频率 (fCLK):200 MHzI/O 类型:COMMON
交错的突发长度:4,8JESD-30 代码:R-PBGA-B60
JESD-609代码:e0内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:8
湿度敏感等级:3端子数量:60
字数:67108864 words字数代码:64000000
最高工作温度:95 °C最低工作温度:
组织:64MX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA60,9X11,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH峰值回流温度(摄氏度):240
电源:1.8 V认证状态:Not Qualified
刷新周期:8192连续突发长度:4,8
最大待机电流:0.008 A子类别:DRAMs
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

K4T51083QB-GCCC 数据手册

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DDR2 SDRAM  
512Mb B-die DDR2 SDRAM  
512Mb B-die DDR2 SDRAM Specification  
Version 1.5  
July 2005  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Page 1 of 28  
Rev. 1.5 July 2005  

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