是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | TFBGA, |
针数: | 54 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.28 |
风险等级: | 5.73 | 访问模式: | FOUR BANK PAGE BURST |
最长访问时间: | 6 ns | 其他特性: | AUTO/SELF REFRESH |
JESD-30 代码: | R-PBGA-B54 | 长度: | 11.5 mm |
内存密度: | 536870912 bit | 内存集成电路类型: | SYNCHRONOUS DRAM |
内存宽度: | 16 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 54 |
字数: | 33554432 words | 字数代码: | 32000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | -25 °C | 组织: | 32MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 自我刷新: | YES |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 10 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4S51153PF-YF90 | SAMSUNG |
获取价格 |
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA | |
K4S51153PF-YF900 | SAMSUNG |
获取价格 |
Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, FBGA-54 | |
K4S51153PF-YPF | SAMSUNG |
获取价格 |
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA | |
K4S51153PF-YPF1L | SAMSUNG |
获取价格 |
8M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA | |
K4S511632B-CL75 | SAMSUNG |
获取价格 |
512Mb B-die SDRAM Specification | |
K4S511632B-TC75 | SAMSUNG |
获取价格 |
512Mb B-die SDRAM Specification | |
K4S511632B-TC750 | SAMSUNG |
获取价格 |
Synchronous DRAM, 32MX16, 5.4ns, CMOS, PDSO54, TSOP-54 | |
K4S511632B-TCL75 | SAMSUNG |
获取价格 |
512Mb B-die SDRAM Specification | |
K4S511632B-TL750 | SAMSUNG |
获取价格 |
Synchronous DRAM, 32MX16, 5.4ns, CMOS, PDSO54, TSOP-54 | |
K4S511632B-UC75 | SAMSUNG |
获取价格 |
512Mb B-die SDRAM Specification |