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K4H560438E-GCB3 PDF预览

K4H560438E-GCB3

更新时间: 2024-02-20 13:47:46
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路动态存储器双倍数据速率时钟
页数 文件大小 规格书
24页 244K
描述
256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)

K4H560438E-GCB3 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete包装说明:BGA, BGA60,9X12,40/32
Reach Compliance Code:compliant风险等级:5.92
Is Samacsys:N最长访问时间:0.7 ns
最大时钟频率 (fCLK):166 MHzI/O 类型:COMMON
交错的突发长度:2,4,8JESD-30 代码:R-PBGA-B60
内存密度:268435456 bit内存集成电路类型:DDR DRAM
内存宽度:4湿度敏感等级:3
端子数量:60字数:67108864 words
字数代码:64000000最高工作温度:70 °C
最低工作温度:组织:64MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA60,9X12,40/32
封装形状:RECTANGULAR封装形式:GRID ARRAY
峰值回流温度(摄氏度):240电源:2.5 V
认证状态:Not Qualified刷新周期:8192
连续突发长度:2,4,8最大待机电流:0.003 A
子类别:DRAMs最大压摆率:0.26 mA
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

K4H560438E-GCB3 数据手册

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DDR SDRAM 256Mb E-die (x4, x8)  
DDR SDRAM  
256Mb E-die DDR SDRAM Specification  
60Ball FBGA (x4/x8)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.3 April, 2005  

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