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K4E660412E-JP600 PDF预览

K4E660412E-JP600

更新时间: 2024-02-18 09:45:38
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
21页 192K
描述
EDO DRAM, 16MX4, 60ns, CMOS, PDSO32,

K4E660412E-JP600 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:SOJ, SOJ32,.44Reach Compliance Code:compliant
风险等级:5.83最长访问时间:60 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-J32
内存密度:67108864 bit内存集成电路类型:EDO DRAM
内存宽度:4端子数量:32
字数:16777216 words字数代码:16000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:16MX4输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ32,.44封装形状:RECTANGULAR
封装形式:SMALL OUTLINE电源:3.3 V
认证状态:Not Qualified刷新周期:8192
自我刷新:YES最大待机电流:0.0002 A
子类别:DRAMs最大压摆率:0.1 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:J BEND端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

K4E660412E-JP600 数据手册

 浏览型号K4E660412E-JP600的Datasheet PDF文件第2页浏览型号K4E660412E-JP600的Datasheet PDF文件第3页浏览型号K4E660412E-JP600的Datasheet PDF文件第4页浏览型号K4E660412E-JP600的Datasheet PDF文件第5页浏览型号K4E660412E-JP600的Datasheet PDF文件第6页浏览型号K4E660412E-JP600的Datasheet PDF文件第7页 
Industrial Temperature  
K4E660412E,K4E640412E  
CMOS DRAM  
16M x 4bit CMOS Dynamic RAM with Extended Data Out  
DESCRIPTION  
This is a family of 16,777,216 x 4 bit Extended Data Out Mode CMOS DRAMs. Extended Data Out Mode offers high speed random  
access of memory cells within the same row. Refresh cycle(4K Ref. or 8K Ref.), access time (-45, -50 or -60), power consumption(Nor-  
mal or Low power) are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden  
refresh capabilities. Furthermore, Self-refresh operation is available in L-version. This 16Mx4 EDO Mode DRAM family is fabricated  
using Samsung¢s advanced CMOS process to realize high band-width, low power consumption and high reliability.  
FEATURES  
• Extended Data Out Mode operation  
• CAS-before-RAS refresh capability  
• RAS-only and Hidden refresh capability  
• Self-refresh capability (L-ver only)  
• Fast parallel test mode capability  
• LVTTL(3.3V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
• Part Identification  
- K4E660412E-JI/P(3.3V, 8K Ref., SOJ)  
- K4E640412E-JI/P(3.3V, 4K Ref., SOJ)  
- K4E660412E-TI/P(3.3V, 8K Ref., TSOP)  
- K4E640412E-TI/P(3.3V, 4K Ref., TSOP)  
Active Power Dissipation  
Unit : mW  
4K  
Speed  
-45  
8K  
• Available in Plastic SOJ and TSOP(II) packages  
• +3.3V±0.3V power supply  
324  
288  
252  
432  
396  
360  
-50  
Industrial Temperature operating ( -40~85°C )  
-60  
Refresh Cycles  
FUNCTIONAL BLOCK DIAGRAM  
Part  
NO.  
Refresh  
cycle  
Refresh time  
Normal  
L-ver  
RAS  
CAS  
W
Vcc  
Vss  
Control  
Clocks  
K4E660412E*  
K4E640412E  
8K  
4K  
64ms  
128ms  
VBB Generator  
* Access mode & RAS only refresh mode  
: 8K cycle/64ms(Normal), 8K cycle/128ms(L-ver.)  
CAS -before-RAS & Hidden refresh mode  
Row Decoder  
Refresh Timer  
Data in  
Buffer  
Refresh Control  
Memory Array  
: 4K cycle/64ms(Normal), 4K cycle/128ms(L-ver.)  
DQ0  
to  
DQ3  
16,777,216 x 4  
Refresh Counter  
Performance Range  
Cells  
Speed  
-45  
Data out  
Buffer  
tRAC  
45ns  
50ns  
60ns  
tCAC  
12ns  
13ns  
15ns  
tRC  
tHPC  
17ns  
20ns  
25ns  
Row Address Buffer  
A0~A12  
(A0~A11)*1  
74ns  
84ns  
104ns  
Col. Address Buffer  
Column Decoder  
A0~A10  
(A0~A11)*1  
-50  
-60  
Note) *1 : 4K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

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