生命周期: | Active | 包装说明: | TSOP2, |
Reach Compliance Code: | compliant | 风险等级: | 5.73 |
访问模式: | FAST PAGE WITH EDO | 最长访问时间: | 60 ns |
其他特性: | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | JESD-30 代码: | R-PDSO-G32 |
长度: | 20.95 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | EDO DRAM | 内存宽度: | 8 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 32 | 字数: | 8388608 words |
字数代码: | 8000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 8MX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP2 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 宽度: | 10.16 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
K4E660812B | SAMSUNG | 8M x 8bit CMOS Dynamic RAM with Extended Data Out |
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K4E660812B-TC450 | SAMSUNG | EDO DRAM, 8MX8, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 |
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K4E660812B-TC600 | SAMSUNG | EDO DRAM, 8MX8, 65ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 |
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K4E660812C | SAMSUNG | 8M x 8bit CMOS Dynamic RAM with Extended Data Out |
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K4E660812C-JC450 | SAMSUNG | EDO DRAM, 8MX8, 45ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 |
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K4E660812C-JC50 | SAMSUNG | EDO DRAM, 8MX8, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 |
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