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JANTXVH2N7270 PDF预览

JANTXVH2N7270

更新时间: 2024-01-19 06:16:40
品牌 Logo 应用领域
其他 - ETC 晶体晶体管脉冲局域网
页数 文件大小 规格书
25页 120K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 500V V(BR)DSS | 11A I(D) | TO-254AA

JANTXVH2N7270 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ObsoleteReach Compliance Code:unknown
ECCN代码:3A001.A.1.AHTS代码:8541.29.00.95
风险等级:5.1其他特性:RADIATION HARDENED
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE最小漏源击穿电压:500 V
最大漏极电流 (Abs) (ID):11 A最大漏极电流 (ID):11 A
最大漏源导通电阻:0.45 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBCC-N3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
最大脉冲漏极电流 (IDM):44 A认证状态:Not Qualified
参考标准:MIL-19500/603E子类别:FET General Purpose Powers
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

JANTXVH2N7270 数据手册

 浏览型号JANTXVH2N7270的Datasheet PDF文件第4页浏览型号JANTXVH2N7270的Datasheet PDF文件第5页浏览型号JANTXVH2N7270的Datasheet PDF文件第6页浏览型号JANTXVH2N7270的Datasheet PDF文件第8页浏览型号JANTXVH2N7270的Datasheet PDF文件第9页浏览型号JANTXVH2N7270的Datasheet PDF文件第10页 
MIL-PRF-19500/603C  
4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-PRF-19500 and table III herein.  
4.3 Screening (JANTXV and JANS levels only). Screening shall be in accordance with appendix E, table IV of MIL-PRF-19500 and  
as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table  
I herein shall not be acceptable.  
Screen (see appendix E,  
table IV of  
Measurement  
MIL-PRF-19500)  
JANS level  
Method 3470 (see 4.5.4)  
JANTXV levels  
Method 3470 (see 4.5.4)  
1/  
1/  
Method 3161 (see 4.5.3)  
Method 3161 (see 4.5.3)  
1/  
Gate stress test (see 4.5.5)  
Gate stress test (see 4.5.5)  
9 1/  
10  
11  
Subgroup 2 of table II herein. I  
, I  
GSS DSS1  
Subgroup 2 of table I herein  
MIL-STD-750, method 1042, test condition B  
MIL-STD-750, method 1042, test condition B  
I
, I  
, I  
, r  
, V  
I
, I  
, I  
, r  
, V  
GSSF1 GSSR1 DSS1 DS(on) GS(TH)  
GSSF1 GSSR1 DSS1 DS(on) GS(TH)  
Subgroup 2 of table I herein  
Subgroup 2 of table I herein  
I  
= ± 20 nA dc or ± 100 percent of  
initial value, whichever is greater.  
GSSF1  
I  
GSSR1  
= ± 20 nA dc or ± 100 percent of  
initial value, whichever is greater.  
I  
DSS1  
= ± 10 µA dc or ± 100 percent of  
initial value, whichever is greater.  
12  
13  
MIL-STD-750, method 1042, test condition A  
Subgroups 2 and 3 of table I herein  
MIL-STD-750, method 1042, test condition A  
Subgroups 2 and 3 of table I herein  
I  
= ± 20 nA dc or ± 100 percent of  
initial value, whichever is greater.  
I  
= ± 20 nA dc or ± 100 percent of  
initial value, whichever is greater.  
GSSF1  
GSSF1  
I  
GSSR1  
= ± 20 nA dc or ± 100 percent of  
I  
GSSR1  
= ± 20 nA dc or ± 100 percent of  
initial value, whichever is greater.  
initial value, whichever is greater.  
I  
= ± 10 µA dc or ± 100 percent of  
initial value, whichever is greater.  
I  
= ± 10 µA dc or ± 100 percent of  
initial value, whichever is greater.  
DSS1  
DSS1  
r  
DS(on)1  
=± 20 percent of initial value  
= ± 20 percent of initial value  
r  
DS(on)1  
=± 20 percent of initial value  
= ± 20 percent of initial value  
V  
V  
GS(th)1  
GS(th)1  
1/ Shall be performed anytime before screen 10.  
7

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