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ISL8200AMIRZ PDF预览

ISL8200AMIRZ

更新时间: 2024-11-28 02:57:35
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
25页 1730K
描述
Complete Current Share 10A DC/DC Power Module

ISL8200AMIRZ 数据手册

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DATASHEET  
ISL8200AM  
Complete Current Share 10A DC/DC Power Module  
FN8271  
Rev.7.00  
Apr 27, 2018  
The ISL8200AM is a simple and easy to use high power,  
current-sharing DC/DC power module for datacom, telecom,  
and FPGA power hungry applications. All that is needed is the  
Features  
• Complete switch mode power supply in one package  
ISL8200AM, a few passive components, and one V  
resistor to have a complete 10A design ready for market.  
setting  
• Patented current share architecture reduces layout  
sensitivity when modules are paralleled  
OUT  
The ease of use practically eliminates design and  
manufacturing risks while dramatically improving time to  
market.  
• Programmable phase shift (1- to 6-phase)  
• Extremely low profile (2.2mm height)  
• Input voltage range +3V to +20V at 10A, current share  
up to 60A  
Parallel up to six ISL8200AM modules to scale up to a 60A  
solution for more output current (see Figure 7 on page 10).  
• A single resistor sets V  
OUT  
from +0.6V to +6V  
The simplicity of the ISL8200AM is in its “off-the-shelf”,  
unassisted implementation compared to a discrete  
• Output overvoltage, overcurrent, and over-temperature  
protection and undervoltage indication  
implementation. Patented current sharing in multiphase  
operation greatly reduces ripple currents, BOM cost, and  
complexity. For example, parallel two devices for 20A of  
current and up to six for 60A of current. The output voltage can  
be precisely regulated to as low as 0.6V with ±1% output  
voltage regulation over line, load, and temperature variations.  
• RoHS compliant  
Applications  
• Servers, telecom, and datacom applications  
• Industrial and medical equipment  
• Point of load regulation  
The ISL8200AM’s thermally enhanced, compact QFN package  
operates at full load and over-temperature without requiring  
forced air cooling. The package is so thin it can even fit on the  
backside of the PCB. Easy access to all pins with few external  
components reduces the PCB design to a component layer and  
a simple ground layer.  
Related Literature  
For a full list of related documents, visit our website  
ISL8200AM product page  
Complete Functional Schematic  
ISL8200AM Package  
V
= 4.5V TO 20V  
IN  
V
=
0UT  
0.6V TO 6.0V  
P
= 3V TO 20V  
VIN  
VOUT  
PVIN  
VIN  
ISL8200AM  
POWER MODULE  
R
SET  
VOUT_SET  
2.2mm  
EN  
FF  
VSEN_REM-  
PGND1  
10µF  
ISHARE  
5k  
NOTE: For input voltage higher than 4.5V, V can be tied to P  
directly  
VIN  
IN  
(see Figure 24 on page 13 for details).  
FIGURE 1. COMPLETE 10A DESIGN, JUST SELECT R  
FOR THE  
FIGURE 2. THE 2.2mm HEIGHT IS IDEAL FOR THE BACKSIDE OF  
PCB WHEN SPACE AND HEIGHT IS A PREMIUM  
SET  
DESIRED V  
OUT  
FN8271 Rev.7.00  
Apr 27, 2018  
Page 1 of 25  

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