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ISL8200AMMREP PDF预览

ISL8200AMMREP

更新时间: 2024-11-24 12:24:23
品牌 Logo 应用领域
英特矽尔 - INTERSIL 电源电路
页数 文件大小 规格书
24页 1189K
描述
Complete Current Share 10A DC/DC Power Module

ISL8200AMMREP 数据手册

 浏览型号ISL8200AMMREP的Datasheet PDF文件第2页浏览型号ISL8200AMMREP的Datasheet PDF文件第3页浏览型号ISL8200AMMREP的Datasheet PDF文件第4页浏览型号ISL8200AMMREP的Datasheet PDF文件第5页浏览型号ISL8200AMMREP的Datasheet PDF文件第6页浏览型号ISL8200AMMREP的Datasheet PDF文件第7页 
Complete Current Share 10A DC/DC Power Module  
ISL8200AMM  
Features  
• Specifications per DLA VID V62/10608  
• Complete Switch Mode Power Supply in One Package  
The ISL8200AMMREP is a simple and easy to use high  
power, current-sharing DC/DC power module for  
Datacom/Telecom/FPGA power hungry applications. All that  
is needed is the ISL8200AMMREP, a few passive  
• Patented Current Share Architecture Reduces Layout  
Sensitivity when Modules are Paralleled  
components and one V  
setting resistor to have a  
OUT  
• Programmable Phase Shift (1 to 6 Phase)  
• Extremely Low Profile (2.2mm Height)  
complete 10A design ready for market.  
The ease of use virtually eliminates the design and  
manufacturing risks while dramatically improving time to  
market.  
• Input Voltage Range +3.0V to +20V at 10A, Current Share  
up to 60A  
• A Single Resistor Sets V  
OUT  
from +0.6V to +6V  
Need more output current? Parallel up to six ISL8200AMMREP  
modules to scale up to a 60A solution (see Figure 6 on  
page 10).  
• Output Overvoltage, Overcurrent and Over-Temperature  
Protection and Undervoltage Indication  
• Full Mil-Temp Electrical Performance from -55°C to +125°C  
The simplicity of the ISL8200AMMREP is in its "Off The Shelf",  
unassisted implementation versus a discrete implementation.  
Patented current sharing in multi-phase operation greatly  
reduces ripple currents, BOM cost and complexity. For  
example, parallel 2 for 20A and up to 6 for 60A. The output  
voltage can be precisely regulated to as low as 0.6V with ±1%  
output voltage regulation over line, load, and temperature  
variations.  
• Full Traceability Through Assembly and Test byDate/Trace  
Code Assignment  
• Enhanced Process Change Notification  
• Enhanced Obsolescence Management  
Applications  
• Servers, Telecom and Datacom Applications  
• Industrial and Medical Equipment  
• Point of Load Regulation  
The ISL8200AMMREP’s thermally enhanced, compact QFN  
package, operates at full load and over-temperature, without  
requiring forced air cooling. It's so thin it can even fit on the  
back side of the PCB. Easy access to all pins with few external  
components, reduces the PCB design to a component layer  
and a simple ground layer.  
Related Literature  
AN1738 “ISL8200AMEV1PHZ Evaluation Board User’s  
Guide”  
ISL8200AMMREP iSim Model - (Product Information Page)  
Complete Functional Schematic  
ISL8200AMMREP Package  
VOUT RANGE  
0.6V TO 6.0V  
VIN RANGE  
3V TO 20V  
VOUT  
VIN  
PVIN  
ISL8200AMMREP  
POWER MODULE  
RSET  
2.2mm  
VOUT_SET  
VEN  
EN  
FF  
VSEN_REM-  
PGND1  
ISHARE  
10μF  
5kΩ  
FIGURE 2. THE 2.2mm HEIGHT IS IDEAL FOR THE BACKSIDE  
OF PCBS WHEN SPACE AND HEIGHT IS A PREMIUM  
FIGURE 1. COMPLETE 10A DESIGN, JUST SELECT R  
FOR  
SET  
THE DESIRED V  
OUT  
November 27, 2012  
FN8287.1  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2012. All Rights Reserved  
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.  
All other trademarks mentioned are the property of their respective owners.  
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