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IS61NSCS25672-300B PDF预览

IS61NSCS25672-300B

更新时间: 2024-11-11 04:58:39
品牌 Logo 应用领域
美国芯成 - ISSI 静态存储器
页数 文件大小 规格书
32页 183K
描述
RAM 256K x 72, 512K x 36 18Mb Synchronous SRAM

IS61NSCS25672-300B 数据手册

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®
IS61NSCS25672  
IS61NSCS51236  
ISSI  
ADVANCE INFORMATION  
Σ
RAM 256K x 72, 512K x 36  
18Mb Synchronous SRAM  
JUNE 2001  
Features  
• JEDEC SigmaRam pinout and package standard  
• Single 1.8V power supply (VCC): 1.7V (min)  
to 1.9V (max)  
• Dedicated output supply voltage (VCCQ): 1.8V  
or 1.5V typical  
• LVCMOS-compatibleI/Ointerface  
• Common data I/O pins (DQs)  
• Single Data Rate (SDR) data transfers  
• Pipelined (PL) read operations  
• Double Late Write (DLW) write operations  
• Burst and non-burst read and write operations,  
selectable via dedicated control pin (ADV)  
• Internally controlled Linear Burst address  
sequencing during burst operations  
• Burst length of 2, 3, or 4, with automatic address  
wrap  
Bottom View  
209-Bump, 14 mm x 22 mm BGA  
• Full read/write coherency  
• Byte write capability  
1 mm Bump Pitch, 11 x 19 Bump Array  
• Two cycle deselect  
SigmaRAM Family Overview  
• Single-ended input clock (CLK)  
• Data-referenced output clocks (CQ/CQ)  
The IS61NSCS series ΣRAMs are built in compliance with  
the SigmaRAM pinout standard for synchronous SRAMs.  
The implementations are 18,874,368-bit (18Mb) SRAMs.  
These are the first in a family of wide, very low voltage CMOS  
I/O SRAMs designed to operate at the speeds needed to  
implement economical high performance networking  
systems.  
• Selectable output driver impedance via dedicated  
control pin (ZQ)  
• Echo clock outputs track data output drivers  
• Depth expansion capability (2 or 4 banks) via  
programmable chip enables (E2, E3, EP2, EP3)  
ISSIs ΣRAMs are offered in a number of configurations that  
emulate other synchronous SRAMs, such as Burst RAMs,  
NBTRAMs, LateWrite, orDoubleDataRate(DDR)SRAMs.  
The logical differences between the protocols employed by  
these RAMs hinge mainly on various combinations of  
address bursting, output data registering and write cueing.  
ΣRAMs allow a user to implement the interface protocol best  
suited to the task at hand.  
• JTAG boundary scan (subset of IEEE standard  
1149.1)  
• 209 pin (11x19), 1mm pitch, 14mm x 22mm Ball  
Grid Array (BGA) package  
This specific product is Common I/O, SDR, Double Late  
Write & Pipelined Read (same as Pipelined NBT) and in  
the family is identified as 1x1Dp.  
This document contains ADVANCE INFORMATION data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best  
possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
ADVANCE INFORMATION Rev. 00A  
1
06/19/01  

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