是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | LQFP, QFP100,.63X.87 | Reach Compliance Code: | compliant |
风险等级: | 5.57 | 最长访问时间: | 2.6 ns |
其他特性: | PIPELINED ARCHITECTURE | 最大时钟频率 (fCLK): | 250 MHz |
I/O 类型: | COMMON | JESD-30 代码: | R-PQFP-G100 |
长度: | 20 mm | 内存密度: | 9437184 bit |
内存集成电路类型: | ZBT SRAM | 内存宽度: | 36 |
功能数量: | 1 | 端子数量: | 100 |
字数: | 262144 words | 字数代码: | 256000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 256KX36 | |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LQFP | 封装等效代码: | QFP100,.63X.87 |
封装形状: | RECTANGULAR | 封装形式: | FLATPACK, LOW PROFILE |
并行/串行: | PARALLEL | 电源: | 2.5/3.3,3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.6 mm |
最大待机电流: | 0.045 A | 最小待机电流: | 3.14 V |
子类别: | SRAMs | 最大压摆率: | 0.28 mA |
最大供电电压 (Vsup): | 3.465 V | 最小供电电压 (Vsup): | 3.135 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | QUAD | 宽度: | 14 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IS61NLP25636A-250TQ-TR | ISSI |
获取价格 |
ZBT SRAM, 256KX36, 2.6ns, CMOS, PQFP100, | |
IS61NLP25636B-200B2L | ISSI |
获取价格 |
ZBT SRAM, 256KX36, 3.1ns, CMOS, PBGA119, BGA-119 | |
IS61NLP25636B-200B3LI-TR | ISSI |
获取价格 |
ZBT SRAM, | |
IS61NLP25636B-200TQLI | ISSI |
获取价格 |
ZBT SRAM, 256KX36, 3.1ns, CMOS, PQFP100, LQFP-100 | |
IS61NLP25672 | ISSI |
获取价格 |
256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM | |
IS61NLP25672-200B1 | ISSI |
获取价格 |
256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM | |
IS61NLP25672-200B1I | ISSI |
获取价格 |
256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM | |
IS61NLP25672-200B1LI | ISSI |
获取价格 |
ZBT SRAM, 256KX72, 3.1ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, LFBGA | |
IS61NLP25672-250B1 | ISSI |
获取价格 |
256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM | |
IS61NLP25672-250B1I | ISSI |
获取价格 |
256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM |