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IS61C256AL-12TI PDF预览

IS61C256AL-12TI

更新时间: 2024-11-29 04:44:47
品牌 Logo 应用领域
美国芯成 - ISSI /
页数 文件大小 规格书
12页 98K
描述
32K x 8 HIGH-SPEED CMOS STATIC RAM

IS61C256AL-12TI 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSOP
包装说明:PLASTIC, TSOP1-28针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.41风险等级:5.38
最长访问时间:12 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G28JESD-609代码:e0
长度:11.8 mm内存密度:262144 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:28字数:32768 words
字数代码:32000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP28,.53,22封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.0001 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.025 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.55 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:8 mm
Base Number Matches:1

IS61C256AL-12TI 数据手册

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®
IS61C256AL  
ISSI  
32K x 8 HIGH-SPEED CMOS STATIC RAM  
OCTOBER2006  
DESCRIPTION  
FEATURES  
The ISSI IS61C256AL is a very high-speed, low power,  
32,768 word by 8-bit static RAMs. It is fabricated using  
ISSI's high-performance CMOS technology. This highly  
reliable process coupled with innovative circuit design  
techniques,yieldsaccesstimesasfastas10nsmaximum.  
• High-speed access time: 10, 12 ns  
• CMOS Low Power Operation  
— 1 mW (typical) CMOS standby  
— 125 mW (typical) operating  
• Fully static operation: no clock or refresh  
required  
When CE is HIGH (deselected), the device assumes a  
standby mode at which the power dissipation can be  
reduced down to 150 µW (typical) with CMOS input levels.  
• TTL compatible inputs and outputs  
• Single 5V power supply  
• Lead-free available  
Easy memory expansion is provided by using an active  
LOW Chip Enable (CE) input and an active LOW Output  
Enable (OE) input. The active LOW Write Enable (WE)  
controls both writing and reading of the memory.  
TheIS61C256ALispincompatiblewithother32Kx8SRAMs  
and are available in 28-pin SOJ and TSOP (Type I)  
packages.  
FUNCTIONAL BLOCK DIAGRAM  
32K X 8  
MEMORY ARRAY  
A0-A14  
DECODER  
VDD  
GND  
I/O  
DATA  
CIRCUIT  
COLUMN I/O  
I/O0-I/O7  
CE  
CONTROL  
CIRCUIT  
OE  
WE  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
1
Rev. B  
10/23/06  

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