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IRL620 PDF预览

IRL620

更新时间: 2024-11-17 22:48:03
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管局域网
页数 文件大小 规格书
8页 392K
描述
Power MOSFET(Vdss=200V, Rds(on)=0.80ohm, Id=5.2A)

IRL620 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
PD -9.1217  
IRL620  
HEXFET® Power MOSFET  
Dynamic dv/dt Rating  
Repetitive Avalanche Rated  
Logic-Level Gate Drive  
RDS(ON) Specified at VGS = 4V & 5V  
Fast Switching  
Ease of paralleling  
Simple Drive Requirements  
VDSS = 200V  
RDS(on) = 0.80Ω  
ID = 5.2A  
Description  
Third Generation HEXFETs from International Rectifier provide the designer  
with the best combination of fast switching, ruggedized device design, low on-  
resistance and cost-effectiveness.  
The TO-220 package is universally preferred for all commercial-industrial  
applications at power dissipation levels to approximately 50 watts. The low thermal  
resistance and low package cost of the TO-220 contribute to its wide acceptance  
throughout the industry.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, V GS @ 5.0V  
Continuous Drain Current, V GS @ 5.0V  
Pulsed Drain Current  
5.2  
3.3  
A
21  
PD @TC = 25°C  
Power Dissipation  
50  
W
W/°C  
V
Linear Derating Factor  
0.40  
±10  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current  
125  
mJ  
A
5.2  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
5.0  
mJ  
V/ns  
5.0  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Min.  
Typ.  
Max.  
2.5  
Units  
RθJC  
RθCS  
RθJA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
°C/W  
62  
Revision 0  
To Order  
 
 

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