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IRL620S, SiHL620S PDF预览

IRL620S, SiHL620S

更新时间: 2023-12-06 20:02:31
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威世 - VISHAY /
页数 文件大小 规格书
10页 1478K
描述
Power MOSFET

IRL620S, SiHL620S 数据手册

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IRL620S, SiHL620S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
D
• Surface-mount  
• Available in tape and reel  
• Dynamic dV/dt rating  
D2PAK (TO-263)  
Available  
Available  
• Repetitive avalanche rated  
• Logic level gate drive  
G
• RDS(on) specified at VGS = 4 V and 5 V  
• Fast switching  
D
G
S
S
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
Note  
N-Channel MOSFET  
*
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details  
PRODUCT SUMMARY  
VDS (V)  
200  
RDS(on) ()  
VGS = 10 V  
0.80  
DESCRIPTION  
Qg (Max.) (nC)  
Qgs (nC)  
16  
2.9  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
Qgd (nC)  
9.6  
The D2PAK (TO-263) is a surface-mount power package  
capable of accommodating die sizes up to HEX-4. It  
provides the highest power capability and the lowest  
possible on- resistance in any existing surface-mount  
package. The D2PAK (TO-263) is suitable for high current  
applications because of its low internal connection  
resistance and can dissipate up to 2.0 W in a typical surface  
mount application.  
Configuration  
Single  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
Lead (Pb)-free  
D2PAK (TO-263)  
SiHL620S-GE3  
D2PAK (TO-263)  
SiHL620STRL-GE3a  
IRL620STRLPbFa  
IRL620SPbF  
Note  
a. See device orientation  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
VDS  
LIMIT  
200  
10  
UNIT  
V
VGS  
T
C = 25 °C  
5.2  
3.3  
21  
Continuous Drain Current  
V
GS at 5 V  
ID  
A
TC = 100 °C  
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.40  
0.025  
125  
5.2  
5.0  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
EAR  
mJ  
A
mJ  
Repetitive Avalanche Energya  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TC = 25 °C  
TA = 25 °C  
50  
3.1  
5.0  
PD  
W
V/ns  
°C  
dV/dt  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)  
b. VDD = 50 V, starting TJ = 25 °C, L = 6.9 mH, Rg = 25 , IAS = 5.2 A (see fig. 12)  
c. ISD 5.2 A, dI/dt 95 A/μs, VDD VDS, TJ 150 °C  
d. 1.6 mm from case  
e. When mounted on 1" square PCB (FR-4 or G-10 material)  
S21-0932-Rev. D, 13-Sep-2021  
Document Number: 91302  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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