IRL620S, SiHL620S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
D
• Surface-mount
• Available in tape and reel
• Dynamic dV/dt rating
D2PAK (TO-263)
Available
Available
• Repetitive avalanche rated
• Logic level gate drive
G
• RDS(on) specified at VGS = 4 V and 5 V
• Fast switching
D
G
S
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
N-Channel MOSFET
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
PRODUCT SUMMARY
VDS (V)
200
RDS(on) ()
VGS = 10 V
0.80
DESCRIPTION
Qg (Max.) (nC)
Qgs (nC)
16
2.9
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
Qgd (nC)
9.6
The D2PAK (TO-263) is a surface-mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on- resistance in any existing surface-mount
package. The D2PAK (TO-263) is suitable for high current
applications because of its low internal connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
D2PAK (TO-263)
SiHL620S-GE3
D2PAK (TO-263)
SiHL620STRL-GE3a
IRL620STRLPbFa
IRL620SPbF
Note
a. See device orientation
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
VDS
LIMIT
200
10
UNIT
V
VGS
T
C = 25 °C
5.2
3.3
21
Continuous Drain Current
V
GS at 5 V
ID
A
TC = 100 °C
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.40
0.025
125
5.2
5.0
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
EAR
mJ
A
mJ
Repetitive Avalanche Energya
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TC = 25 °C
TA = 25 °C
50
3.1
5.0
PD
W
V/ns
°C
dV/dt
TJ, Tstg
- 55 to + 150
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11)
b. VDD = 50 V, starting TJ = 25 °C, L = 6.9 mH, Rg = 25 , IAS = 5.2 A (see fig. 12)
c. ISD 5.2 A, dI/dt 95 A/μs, VDD VDS, TJ 150 °C
d. 1.6 mm from case
e. When mounted on 1" square PCB (FR-4 or G-10 material)
S21-0932-Rev. D, 13-Sep-2021
Document Number: 91302
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000