IRHNMC9A7024 (JANSR2N7650U8C)
Radiation Hardened Power MOSFET Surface mount (SMD-0.2 Ceramic Lid)
Device Characteristics
2
Device Characteristics
2.1
Electrical Characteristics (Pre-Irradiation)
Table 3
Static and Dynamic Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Symbol
Parameter
Min. Typ. Max. Unit Test Conditions
Drain-to-Source Breakdown
Voltage
BVDSS
60
—
—
—
—
V
VGS = 0V, ID = 1.0mA
Breakdown Voltage Temp.
Coefficient
BVDSS/TJ
0.06
V/°C Reference to 25°C, ID = 1.0mA
Static Drain-to-Source On-State
Resistance
RDS(on)
—
2.0
—
—
—
30
4.0
—
m
V
VGS = 12V, ID2 = 20A 1
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 650A
Gate Threshold Voltage
Coefficient
VGS(th)/TJ
Gfs
-7.2
mV/°C
S
Forward Transconductance
10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.0
10
VDS = 15V, ID2 = 20A 1
VDS = 48V, VGS = 0V
VDS = 48V, VGS = 0V, TJ = 125°C
VGS = 20V
IDSS
IGSS
Zero Gate Voltage Drain Current
A
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
100
-100
31
nA
VGS = -20V
QG
ID1 = 25A
VDS = 30V
VGS = 12V
QGS
QGD
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
10
nC
6.4
11
ID1 = 25A **
20
VDD = 30V
RG = 7.5
VGS = 12V
ns
td(off)
tf
Turn-Off Delay Time
Fall Time
29
12
Measured from center of Drain
pad to center of Source pad
Ls +LD
Total Inductance
—
6.8
—
nH
Ciss
Coss
Crss
RG
Input Capacitance
—
—
—
—
1160
440
2.6
—
—
—
—
VGS = 0V
VDS = 25V
ƒ = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
pF
1.5
ƒ = 1.0MHz, open drain
** Switching speed maximum limits are based on manufacturing test equipment and capability.
1 Pulse width 300 µs; Duty Cycle 2%
4 of 14
2022-04-25