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IRHM3054

更新时间: 2024-11-24 03:36:55
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 167K
描述
RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA)

IRHM3054 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, CERAMIC PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.25
雪崩能效等级(Eas):500 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):35 A
最大漏极电流 (ID):35 A最大漏源导通电阻:0.03 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-254AA
JESD-30 代码:S-CSFM-P3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:SQUARE
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
最大脉冲漏极电流 (IDM):140 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:TIN LEAD端子形式:PIN/PEG
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRHM3054 数据手册

 浏览型号IRHM3054的Datasheet PDF文件第2页浏览型号IRHM3054的Datasheet PDF文件第3页浏览型号IRHM3054的Datasheet PDF文件第4页浏览型号IRHM3054的Datasheet PDF文件第5页浏览型号IRHM3054的Datasheet PDF文件第6页浏览型号IRHM3054的Datasheet PDF文件第7页 
PD - 90887E  
IRHM7054  
JANSR2N7394  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (TO-254AA)  
60V, N-CHANNEL  
REF: MIL-PRF-19500/603  
RAD HardHEXFET® TECHNOLOGY  
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
QPL Part Number  
IRHM7054  
IRHM3054  
100K Rads (Si)  
300K Rads (Si)  
0.02735*A JANSR2N7394  
0.02735*A JANSF2N7394  
IRHM4054  
IRHM8054  
600K Rads (Si)  
1000K Rads (Si)  
0.02735*A JANSG2N7394  
0.02735*A JANSH2N7394  
TO-254AA  
International Rectifier’s RADHard HEXFET®technology  
provides high performance power MOSFETs for  
space applications. This technology has over a  
decade of proven performance and reliability in  
satellite applications. These devices have been  
characterized for both Total Dose and Single Event  
Effects (SEE). The combination of low Rdson and  
low gate charge reduces the power losses in  
switching applications such as DC to DC converters  
and motor control. These devices retain all of the well  
established advantages of MOSFETs such as voltage  
control, fast switching, ease of paralleling and  
temperature stability of electrical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C Continuous Drain Current  
35*  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
30  
140  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
150  
W
W/°C  
V
D
C
1.2  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
500  
mJ  
A
AS  
I
35  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
15  
mJ  
V/ns  
AR  
dv/dt  
3.5  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
300 (0.063 in.(1.6mm) from case for 10s)  
9.3 (Typical )  
Lead Temperature  
Weight  
For footnotes refer to the last page  
*Current is limited by package  
www.irf.com  
1
08/30/04  

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