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IRFU3709ZCPBF PDF预览

IRFU3709ZCPBF

更新时间: 2024-11-24 12:04:59
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体转换器晶体管脉冲计算机
页数 文件大小 规格书
11页 4285K
描述
High Frequency Synchronous Buck Converters for Computer Processor Power

IRFU3709ZCPBF 数据手册

 浏览型号IRFU3709ZCPBF的Datasheet PDF文件第2页浏览型号IRFU3709ZCPBF的Datasheet PDF文件第3页浏览型号IRFU3709ZCPBF的Datasheet PDF文件第4页浏览型号IRFU3709ZCPBF的Datasheet PDF文件第5页浏览型号IRFU3709ZCPBF的Datasheet PDF文件第6页浏览型号IRFU3709ZCPBF的Datasheet PDF文件第7页 
PD - 96046  
IRFR3709ZCPbF  
IRFU3709ZCPbF  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
l Lead-Free  
VDSS RDS(on) max  
Qg  
17nC  
6.5m  
30V  
Benefits  
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
I-Pak  
IRFU3709ZCPbF  
D-Pak  
IRFR3709ZCPbF  
Absolute Maximum Ratings  
Parameter  
Drain-to-Source Voltage  
Max.  
30  
Units  
V
VDS  
V
Gate-to-Source Voltage  
± 20  
86  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TC = 25°C  
A
D
D
61  
@ TC = 100°C  
340  
79  
DM  
P
P
@TC = 25°C  
@TC = 100°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
W
D
D
39  
Linear Derating Factor  
Operating Junction and  
0.53  
W/°C  
°C  
T
-55 to + 175  
J
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.9  
Units  
Rθ  
Rθ  
Rθ  
Junction-to-Case  
°C/W  
JC  
JA  
JA  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
50  
110  
www.kersemi.com  
1
04/20/06  

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