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IRFU2405PBF PDF预览

IRFU2405PBF

更新时间: 2024-11-09 03:58:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管
页数 文件大小 规格书
10页 218K
描述
HEXFET Power MOSFET

IRFU2405PBF 数据手册

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PD - 95369A  
IRFR2405PbF  
IRFU2405PbF  
HEXFET® Power MOSFET  
l Surface Mount (IRFR2405)  
l Straight Lead (IRFU2405)  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l Fast Switching  
D
VDSS = 55V  
l Fully Avalanche Rated  
l Lead-Free  
RDS(on) = 0.016Ω  
G
Description  
ID = 56A†  
Seventh Generation HEXFET® Power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance per  
silicon area. This benefit, combined with the fast  
switching speed and ruggedized device design that  
HEXFET power MOSFETs are well known for, provides  
the designer with an extremely efficient and reliable  
device for use in a wide variety of applications.  
S
The D-Pak is designed for surface mounting using  
vapor phase, infrared, or wave soldering techniques.  
The straight lead version (IRFU series) is for through-  
hole mounting applications. Power dissipation levels  
up to 1.5 watts are possible in typical surface mount  
applications.  
D-Pak  
IRFR2405  
I-Pak  
IRFU2405  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
56†  
40†  
220  
110  
0.71  
± 20  
130  
34  
A
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
11  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
1.4  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount)*  
Junction-to-Ambient  
°C/W  
110  
*
When mounted on 1" square PCB (FR-4 or G-10 Material) .  
For recommended footprint and soldering techniques refer to application note #AN-994  
www.irf.com  
1
12/03/04  

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