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IRFU310 PDF预览

IRFU310

更新时间: 2024-11-24 12:04:59
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科盛美 - KERSEMI /
页数 文件大小 规格书
7页 3933K
描述
Power MOSFET

IRFU310 数据手册

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IRFR310, IRFU310, SiHFR310, SiHFU310  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
400  
Available  
• Repetitive Avalanche Rated  
3.6  
RDS(on) (Ω)  
VGS = 10 V  
RoHS*  
• Surface Mount (IRFR310/SiHFR310)  
COMPLIANT  
Qg (Max.) (nC)  
12  
1.9  
6.5  
• Straight Lead (IRFU310/SiHFU310)  
• Available in Tape and Reel  
• Fast Switching  
Q
gs (nC)  
Qgd (nC)  
Configuration  
Single  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
D
DPAK  
IPAK  
(TO-252)  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs form Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR310PbF  
SiHFR310-E3  
IRFR310  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR310TRPbFa  
SiHFR310T-E3a  
IRFR310TRa  
DPAK (TO-252)  
IRFR310TRRPbFa  
SiHFR310TR-E3a  
IPAK (TO-251)  
IRFU310PbF  
SiHFU310-E3  
IRFU310  
IRFR310TRLPbFa  
SiHFR310TL-E3a  
IRFR310TRLa  
Lead (Pb)-free  
-
-
SnPb  
SiHFR310  
SiHFR310TLa  
SiHFR310Ta  
SiHFU310  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
400  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
1.7  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
1.1  
A
Pulsed Drain Currenta  
IDM  
6.0  
Linear Derating Factor  
0.20  
0.020  
86  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
mJ  
A
1.7  
Repetitive Avalanche Energya  
EAR  
2.5  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
25  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
4.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 52 mH, RG = 25 Ω, IAS = 1.7 A (see fig. 12).  
c. ISD 1.7 A, dI/dt 40 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1” square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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