IRFR310, IRFU310, SiHFR310, SiHFU310
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
400
Available
• Repetitive Avalanche Rated
3.6
RDS(on) (Ω)
VGS = 10 V
RoHS*
• Surface Mount (IRFR310/SiHFR310)
COMPLIANT
Qg (Max.) (nC)
12
1.9
6.5
• Straight Lead (IRFU310/SiHFU310)
• Available in Tape and Reel
• Fast Switching
Q
gs (nC)
Qgd (nC)
Configuration
Single
• Fully Avalanche Rated
• Lead (Pb)-free Available
D
DPAK
IPAK
(TO-252)
(TO-251)
DESCRIPTION
Third generation Power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR310PbF
SiHFR310-E3
IRFR310
DPAK (TO-252)
DPAK (TO-252)
IRFR310TRPbFa
SiHFR310T-E3a
IRFR310TRa
DPAK (TO-252)
IRFR310TRRPbFa
SiHFR310TR-E3a
IPAK (TO-251)
IRFU310PbF
SiHFU310-E3
IRFU310
IRFR310TRLPbFa
SiHFR310TL-E3a
IRFR310TRLa
Lead (Pb)-free
-
-
SnPb
SiHFR310
SiHFR310TLa
SiHFR310Ta
SiHFU310
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
400
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
TC = 25 °C
1.7
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
1.1
A
Pulsed Drain Currenta
IDM
6.0
Linear Derating Factor
0.20
0.020
86
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
mJ
A
1.7
Repetitive Avalanche Energya
EAR
2.5
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
25
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
4.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 52 mH, RG = 25 Ω, IAS = 1.7 A (see fig. 12).
c. ISD ≤ 1.7 A, dI/dt ≤ 40 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1” square PCB (FR-4 or G-10 material).
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