PD - 95772A
IRFR120ZPbF
AUTOMOTIVE MOSFET
IRFU120ZPbF
HEXFET® Power MOSFET
Features
D
l
l
l
l
l
l
Advanced Process Technology
VDSS = 100V
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
RDS(on) = 190mΩ
G
ID = 8.7A
S
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating tempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an extremely
efficientandreliabledeviceforuseinAutomotiveapplicationsand
a wide variety of other applications.
D-Pak
IRFR120Z
I-Pak
IRFU120Z
Absolute Maximum Ratings
Parameter
Max.
8.7
6.1
35
Units
A
(Silicon Limited)
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
@ T = 25°C
C
D
D
@ T = 100°C
C
DM
P
@T = 25°C
Power Dissipation
C
35
W
D
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
0.23
± 20
W/°C
V
V
GS
EAS (Thermally limited)
18
20
mJ
Single Pulse Avalanche Energy Tested Value
Avalanche Current
EAS (Tested )
IAR
See Fig.12a, 12b, 15, 16
A
Repetitive Avalanche Energy
EAR
mJ
T
J
Operating Junction and
-55 to + 175
T
Storage Temperature Range
°C
STG
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
300 (1.6mm from case )
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
–––
–––
Max.
4.28
40
Units
Rθ
Rθ
Rθ
Junction-to-Case
Junction-to-Ambient (PCB mount)
JC
JA
JA
°C/W
Junction-to-Ambient
110
HEXFET® is a registered trademark of International Rectifier.
www.irf.com
1
12/06/04