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IRFR12N25DHR PDF预览

IRFR12N25DHR

更新时间: 2024-11-21 13:08:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体开关晶体管功率场效应晶体管脉冲
页数 文件大小 规格书
10页 108K
描述
暂无描述

IRFR12N25DHR 技术参数

是否Rohs认证: 不符合生命周期:Lifetime Buy
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.74
雪崩能效等级(Eas):250 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (ID):14 A最大漏源导通电阻:0.26 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):245极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):56 A表面贴装:YES
端子面层:TIN LEAD端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR12N25DHR 数据手册

 浏览型号IRFR12N25DHR的Datasheet PDF文件第2页浏览型号IRFR12N25DHR的Datasheet PDF文件第3页浏览型号IRFR12N25DHR的Datasheet PDF文件第4页浏览型号IRFR12N25DHR的Datasheet PDF文件第5页浏览型号IRFR12N25DHR的Datasheet PDF文件第6页浏览型号IRFR12N25DHR的Datasheet PDF文件第7页 
PD - 94296A  
IRFR12N25D  
IRFU12N25D  
SMPS MOSFET  
HEXFET® Power MOSFET  
Applications  
l High frequency DC-DC converters  
VDSS  
250V  
RDS(on) max  
ID  
14A  
0.26Ω  
Benefits  
l Low Gate-to-Drain Charge to Reduce  
Switching Losses  
l Fully Characterized Capacitance Including  
Effective COSS to Simplify Design, (See  
App. Note AN1001)  
l Fully Characterized Avalanche Voltage  
and Current  
D-Pak  
IRFR12N25D  
I-Pak  
IRFU12N25D  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
14  
9.7  
A
56  
PD @TC = 25°C  
Power Dissipation  
144  
W
W/°C  
V
Linear Derating Factor  
0.96  
VGS  
dv/dt  
TJ  
Gate-to-Source Voltage  
± 30  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
9.3  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
–––  
–––  
–––  
1.04  
Junction-to-Ambient (PCB mount)*  
Junction-to-Ambient  
50  
°C/W  
110  
Notes  through are on page 10  
www.irf.com  
1
09/21/01  

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