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IRFR130 PDF预览

IRFR130

更新时间: 2024-02-02 18:59:42
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 262K
描述
Advanced Power MOSFET

IRFR130 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-252包装说明:DPAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.81
雪崩能效等级(Eas):225 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):13 A最大漏极电流 (ID):13 A
最大漏源导通电阻:0.11 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252JESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):41 W
最大脉冲漏极电流 (IDM):52 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR130 数据手册

 浏览型号IRFR130的Datasheet PDF文件第2页浏览型号IRFR130的Datasheet PDF文件第3页浏览型号IRFR130的Datasheet PDF文件第4页浏览型号IRFR130的Datasheet PDF文件第5页浏览型号IRFR130的Datasheet PDF文件第6页浏览型号IRFR130的Datasheet PDF文件第7页 
IRFR/U130A  
Advanced Power MOSFET  
FEATURES  
BVDSS = 100 V  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
W
RDS(on) = 0.11  
ID = 13 A  
Improved Gate Charge  
Extended Safe Operating Area  
D-PAK  
I-PAK  
m
Lower Leakage Current : 10 A (Max.) @ VDS = 100V  
W
Lower RDS(ON) : 0.092  
(Typ.)  
2
1
1
2
3
3
1. Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Drain-to-Source Voltage  
Value  
100  
13  
Units  
VDSS  
V
O
Continuous Drain Current (TC=25 C)  
ID  
A
O
Continuous Drain Current (TC=100 C)  
8.2  
1
IDM  
VGS  
EAS  
IAR  
Drain Current-Pulsed  
52  
A
V
O
+
_
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
20  
2
225  
13  
mJ  
A
O
1
O
EAR  
dv/dt  
1
Repetitive Avalanche Energy  
4.1  
6.5  
2.5  
41  
mJ  
V/ns  
W
O
3
Peak Diode Recovery dv/dt  
O
O
*
Total Power Dissipation (TA=25  
)
)
C
C
O
PD  
Total Power Dissipation (T =25  
W
C
O
Linear Derating Factor  
0.32  
W/ C  
Operating Junction and  
Storage Temperature Range  
TJ , TSTG  
- 55 to +150  
300  
O
C
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from case for 5-seconds  
TL  
Thermal Resistance  
Symbol  
Characteristic  
Typ.  
Max.  
Units  
R q  
Junction-to-Case  
--  
--  
--  
3.08  
50  
JC  
O
Rq  
*
Junction-to-Ambient  
Junction-to-Ambient  
C /W  
JA  
Rq  
110  
JA  
*
When mounted on the minimum pad size recommended (PCB Mount).  
Rev. B  
©1999 Fairchild Semiconductor Corporation  

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