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IRFHM8337TRPBF PDF预览

IRFHM8337TRPBF

更新时间: 2024-01-30 23:31:29
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲光电二极管晶体管
页数 文件大小 规格书
11页 593K
描述
Power Field-Effect Transistor, 12A I(D), 30V, 0.0124ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, QFN-8

IRFHM8337TRPBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, S-PDSO-F5Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.9
雪崩能效等级(Eas):13 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):35 A最大漏极电流 (ID):12 A
最大漏源导通电阻:0.0124 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-F5湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):25 W
最大脉冲漏极电流 (IDM):94 A子类别:FET General Purpose Power
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFHM8337TRPBF 数据手册

 浏览型号IRFHM8337TRPBF的Datasheet PDF文件第4页浏览型号IRFHM8337TRPBF的Datasheet PDF文件第5页浏览型号IRFHM8337TRPBF的Datasheet PDF文件第6页浏览型号IRFHM8337TRPBF的Datasheet PDF文件第8页浏览型号IRFHM8337TRPBF的Datasheet PDF文件第9页浏览型号IRFHM8337TRPBF的Datasheet PDF文件第10页 
IRFHM8337TRPbF  
Placement and Layout Guidelines  
The typical application topology for this product is the synchronous buck converter. These converters operate at high  
frequencies (typically around 400 kHz). During turn-on and turn-off switching cycles, the high di/dt currents circulating in  
the parasitic elements of the circuit induce high voltage ringing which may exceed the device rating and lead to undesir-  
able effects. One of the major contributors to the increase in parasitics is the PCB power circuit inductance.  
This section introduces a simple guideline that mitigates the effect of these parasitics on the performance of the circuit  
and provides reliable operation of the devices.  
To reduce high frequency switching noise and the effects of Electromagnetic Interference (EMI) when the control  
MOSFET (Q1) is turned on, the layout shown in Figure 19 is recommended. The input bypass capacitors, control  
MOSFET and output capacitors are placed in a tight loop to minimize parasitic inductance which in turn lowers the am-  
plitude of the switch node ringing, and minimizes exposure of the MOSFETs to repetitive avalanche conditions.  
When the synchronous MOSFET (Q2) is turned on, high average DC current flows through the path indicated in Figure  
19. Therefore, the Q2 turn-on path should be laid out with a tight loop and wide traces at both ends of the inductor to  
minimize loop resistance.  
7
2016-2-23  

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