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IRFBC30SPBF PDF预览

IRFBC30SPBF

更新时间: 2024-11-24 05:39:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 962K
描述
Power MOSFET

IRFBC30SPBF 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:compliant
HTS代码:8541.29.00.95Factory Lead Time:9 weeks
风险等级:5.04Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):290 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):3.6 A
最大漏极电流 (ID):3.6 A最大漏源导通电阻:2.2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):74 W
最大脉冲漏极电流 (IDM):14 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFBC30SPBF 数据手册

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IRFBC30S, SiHFBC30S, IRFBC30L, SiHFBC30L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
• Surface Mount (IRFBC30S, SiHFBC30S)  
600  
• Low-Profile Through-Hole (IRFBC30L, SiHFBC30L)  
Available  
• Available in Tape and Reel (IRFBC30S,  
SiHFBC30S)  
• Dynamic dV/dt Rating  
• 150 °C Operating Temperature  
• Fast Switching  
RDS(on) (Ω)  
VGS = 10 V  
2.2  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
31  
4.6  
Q
Q
gs (nC)  
gd (nC)  
17  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
Configuration  
Single  
D
DESCRIPTION  
D2PAK (TO-263)  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
I2PAK (TO-262)  
G
The D2PAK is a surface mount power package capable of  
the accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
G
D
S
S
N-Channel MOSFET  
2.0  
W in a typical surface mount application. The  
through-hole version (IRFBC30L, SiHFBC30L) is a available  
for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRFBC30SPbF  
SiHFBC30S-E3  
IRFBC30S  
D2PAK (TO-263)  
I2PAK (TO-262)  
IRFBC30LPbF  
SiHFBC30L-E3  
IRFBC30L  
IRFBC30STRLPbFa  
Lead (Pb)-free  
SiHFBC30STL-E3a  
-
-
SnPb  
SiHFBC30S  
SiHFBC30L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
600  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
TC = 25 °C  
TC =100°C  
3.6  
2.3  
14  
0.59  
290  
Continuous Drain Currente  
VGS at 10 V  
ID  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
W/°C  
mJ  
A
EAS  
IAR  
3.6  
Repetiitive Avalanche Energya  
EAR  
7.4  
mJ  
TA = 25 °C  
C = 25 °C  
3.1  
74  
3.0  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
T
Peak Diode Recovery dV/dtc, e  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
dV/dt  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 41 mH, RG = 25 Ω, IAS = 3.6 A (see fig. 12).  
c. ISD 3.6 A, dI/dt 60 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses IRFBC30/SiHFBC30 data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91111  
S-Pending-Rev. A, 10-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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