IRFBC20S, SiHFBC20S, IRFBC20L, SiHFBC20L
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
600
• Surface Mount (IRFBC20S, SiHFBC20S)
RDS(on) ()
VGS = 10 V
4.4
•
Low-Profile Through-Hole (IRFBC20L, SiHFBC20L)
• Available in Tape and Reel (IRFBC20, SiiHFBC20S)
• Dynamic dV/dt Rating
• 150 °C Operating Temperature
• Fast Switching
• Fully Avalanche Rated
Qg (Max.) (nC)
18
3.0
Q
Q
gs (nC)
gd (nC)
8.9
Configuration
Single
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
D
D2PAK (TO-263)
I2PAK (TO-262)
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D2PAK is a surface mount power package capable of
the accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application. The
through-hole version (IRFBC20L, SiHFBC20L) is a available
for low-profile applications.
G
G
D
S
D
S
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHFBC20S-GE3
IRFBC20SPbF
SiHFBC20S-E3
D2PAK (TO-263)
I2PAK (TO-262)
SiHFBC20L-GE3
IRFBC20LPbF
SiHFBC20L-E3
Lead (Pb)-free and Halogen-free
SiHFBC20STRL-GE3a
IRFBC20STRLPbFa
SiHFBC20STL-E3a
Lead (Pb)-free
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
VDS
LIMIT
600
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
V
VGS
T
C = 25 °C
2.2
1.4
8.0
0.40
84
Continuous Drain Currente
VGS at 10 V
ID
TC = 100 °C
A
Pulsed Drain Currenta, e
Linear Derating Factor
Single Pulse Avalanche Energyb, e
Avalanche Currenta
IDM
W/°C
mJ
A
EAS
IAR
2.2
5.0
3.1
50
Repetiitive Avalanche Energya
EAR
mJ
TA = 25 °C
Maximum Power Dissipation
Peak Diode Recovery dV/dtc, e
PD
W
V/ns
°C
TC = 25 °C
dV/dt
3.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
300d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 31 mH, Rg = 25 , IAS = 2.2 A (see fig. 12).
c. ISD 2.2 A, dI/dt 40 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. Uses IRFBC20, SiHFBC20 data and test conditions.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91107
S11-1052-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000