PD - 97669
IRF8327SPbF
IRF8327STRPbF
DirectFET® Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant and Halogen Free
l Low Profile (<0.7 mm)
VDSS
VGS
RDS(on)
RDS(on)
30V max ±20V max
5.1mΩ@ 10V 8.5mΩ@ 4.5V
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
l Optimized for High Frequency Switching
l Ideal for CPU Core DC-DC Converters
l Optimized for Control FET application
l Low Conduction and Switching Losses
l Compatible with existing Surface Mount Techniques
l 100% Rg tested
9.2nC 3.0nC 1.2nC
19nC
7.9nC
1.9V
DirectFET® ISOMETRIC
SQ
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SX
ST
MQ
MX
MT
MP
SQ
Description
The IRF8327SPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the
lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET® package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET® package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF8327SPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF8327SPbF has been optimized for parameters that are critical in synchronous buck
operating from 12 volt bus converters including Rds(on) and gate charge to minimize losses.
Absolute Maximum Ratings
Max.
30
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
14
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
11
@ TA = 70°C
@ TC = 25°C
A
60
110
62
DM
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
11
25
20
15
10
5
14.0
12.0
10.0
8.0
I = 11A
I
= 14A
D
D
V
V
V
= 24V
DS
DS
DS
= 15V
= 6.0V
6.0
T
= 125°C
J
4.0
2.0
T
= 25°C
5
J
0
0.0
0
10
15
20
0
5
10
15
20
25
Q
Total Gate Charge (nC)
G
V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Notes:
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 1.1mH, RG = 25Ω, IAS = 11A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
05/04/11