PD - 93812
PD - 93813
IRF7809/IRF7811
IRF7809/IRF7811
Provisional Datasheet
HEXFET® Chipset for DC-DC Converters
• N-Channel Application-Specific MOSFETs
• Ideal for CPU Core DC-DC Converters
• New CopperStrapTM Interconnect for Lower
Electrical and Thermal Resistance
• Low Conduction Losses
• Low Switching Losses
• Minimizes Parallel MOSFETs for high
current applications
A
A
D
1
2
3
4
8
7
S
S
D
6
5
S
D
D
G
Description
These new devices employ advanced HEXFET® Power
MOSFET technology to achieve an unprecedented
balance of on-resistance and gate charge.The reduced
conduction and switching losses make them ideal for
high efficiency DC-DC converters that power the latest
generation of mobile microprocessors.
SO-8
Top View
DEVICE RATINGS
IRF7809
30V
IRF7811
28V
The IRF7809/IRF7811 employs a newCopperStrapTM
interconnect technology pioneered by International
Rectifier to dramatically improve the electrial & thermal
resistance contribution of the package. The new
CopperStrap SO-8 power MOSFETs are capable of
current ratings over 17A and power dissipation of 3.5W
@ 25°C ambient conditions, thereby reducing the need
for paralleled devices, improving efficiency and
reliability and reducing board space.
VDS
RDS
QG
7.5 mΩ
77.5 nC
23.9 nC
30 nC
11 mΩ
23 nC
7 nC
(on)
Qsw
Qoss
31 nC
Absolute Maximum Ratings
Parameter
Symbol
VDS
IRF7809
IRF7811
Units
Drain-Source Voltage
30
28
V
Gate-Source Voltage
VGS
±12
Continuous Drain or Source TA = 25°C
ID
17.6
16.3
100
14
13
Current (VGS ≥ 4.5V)
Pulsed Drain Current
Power Dissipation
TL = 90°C
A
IDM
PD
100
TA = 25°C
TL = 90°C
3.5
3.0
W
Junction & Storage Temperature Range
Continuous Source Current (Body Diode)
Pulsed Source Current
TJ,TSTG
IS
–55 to 150
°C
A
2.5
50
2.5
50
ISM
Thermal Resistance
Parameter
Max.
35
20
Units
°C/W
°C/W
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
RθJA
RθJL
www.irf.com
1
1/19/00
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