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IRF7809 PDF预览

IRF7809

更新时间: 2024-11-19 23:58:51
品牌 Logo 应用领域
其他 - ETC 晶体晶体管
页数 文件大小 规格书
4页 147K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 17A I(D) | SO

IRF7809 数据手册

 浏览型号IRF7809的Datasheet PDF文件第2页浏览型号IRF7809的Datasheet PDF文件第3页浏览型号IRF7809的Datasheet PDF文件第4页 
PD - 93812  
PD - 93813  
IRF7809/IRF7811  
Provisional Datasheet  
HEXFET® Chipset for DC-DC Converters  
N-Channel Application-Specific MOSFETs  
• Ideal for CPU Core DC-DC Converters  
• New CopperStrapTM Interconnect for Lower  
Electrical and Thermal Resistance  
• Low Conduction Losses  
• Low Switching Losses  
• Minimizes Parallel MOSFETs for high  
current applications  
A
A
D
1
2
3
4
8
7
S
S
D
6
5
S
D
D
G
Description  
These new devices employ advanced HEXFET® Power  
MOSFET technology to achieve an unprecedented  
balance of on-resistance and gate charge.The reduced  
conduction and switching losses make them ideal for  
high efficiency DC-DC converters that power the latest  
generation of mobile microprocessors.  
SO-8  
Top View  
DEVICE RATINGS  
IRF7809  
30V  
IRF7811  
28V  
The IRF7809/IRF7811 employs a newCopperStrapTM  
interconnect technology pioneered by International  
Rectifier to dramatically improve the electrial & thermal  
resistance contribution of the package. The new  
CopperStrap SO-8 power MOSFETs are capable of  
current ratings over 17A and power dissipation of 3.5W  
@ 25°C ambient conditions, thereby reducing the need  
for paralleled devices, improving efficiency and  
reliability and reducing board space.  
VDS  
RDS  
QG  
7.5 mΩ  
77.5 nC  
23.9 nC  
30 nC  
11 mΩ  
23 nC  
7 nC  
(on)  
Qsw  
Qoss  
31 nC  
Absolute Maximum Ratings  
Parameter  
Symbol  
VDS  
IRF7809  
IRF7811  
Units  
Drain-Source Voltage  
30  
28  
V
Gate-Source Voltage  
VGS  
±12  
Continuous Drain or Source TA = 25°C  
ID  
17.6  
16.3  
100  
14  
13  
Current (VGS 4.5V)  
Pulsed Drain Current  
Power Dissipation  
TL = 90°C  
A
IDM  
PD  
100  
TA = 25°C  
TL = 90°C  
3.5  
3.0  
W
Junction & Storage Temperature Range  
Continuous Source Current (Body Diode)  
Pulsed Source Current  
TJ,TSTG  
IS  
–55 to 150  
°C  
A
2.5  
50  
2.5  
50  
ISM  
Thermal Resistance  
Parameter  
Max.  
35  
20  
Units  
°C/W  
°C/W  
Maximum Junction-to-Ambientƒ  
Maximum Junction-to-Lead  
RθJA  
RθJL  
www.irf.com  
1
1/19/00  
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