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IRF7307QPBF_10 PDF预览

IRF7307QPBF_10

更新时间: 2024-09-30 11:09:27
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 296K
描述
HEXFETPOWERMOSFET

IRF7307QPBF_10 数据手册

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PD - 96106A  
IRF7307QPbF  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
Advanced Process Technology  
UltraLowOn-Resistance  
Dual N and P Channel MOSFET  
SurfaceMount  
Available in Tape & Reel  
150°COperatingTemperature  
Lead-Free  
N-CHANNEL MOSFET  
1
2
3
4
8
D1  
D1  
S1  
G1  
N-Ch P-Ch  
7
6
5
S2  
D2  
D2  
VDSS  
20V  
-20V  
G2  
P-CHANNEL MOSFET  
Top View  
RDS(on) 0.0500.090Ω  
Description  
TheseHEXFET® PowerMOSFET'sinaDualSO-  
8packageutilizethelastestprocessingtechniques  
toachieveextremelylow on-resistanceper silicon  
area. AdditionalfeaturesoftheseHEXFETPower  
MOSFET's are a 150°C junction operating  
temperature, fast switching speed and improved  
repetitiveavalancherating.Thesebenefitscombine  
to make this design an extremely efficient and  
reliable device for use in a wide variety of  
applications.  
The efficient SO-8 package provides enhanced  
thermal characteristics and dual MOSFET die  
capability making it ideal in a variety of power  
applications. This dual, surface mount SO-8 can  
dramatically reduce board space and is also  
available in Tape & Reel.  
SO-8  
Absolute Maximum Ratings  
Max.  
Parameter  
Units  
N-Channel  
P-Channel  
4.5V  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
10 Sec. Pulse Drain Current, VGS  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
@
5.7-4.7  
5.2  
4.1  
21  
-4.3  
A
-3.4  
-17  
PD@TA = 25°C  
Power Dissipation  
2.0  
0.016  
± 12  
W
W/°C  
V
Linear Derating Factor  
VGS  
Gate-to-Source Voltage  
dv/dt  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
5.0  
-5.0  
V/ns  
°C  
TJ, TSTG  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient„  
–––  
62.5  
°C/W  
www.irf.com  
1
08/02/10  

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