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IDT71T75602S150PFI PDF预览

IDT71T75602S150PFI

更新时间: 2024-11-29 22:37:03
品牌 Logo 应用领域
艾迪悌 - IDT 计数器静态存储器
页数 文件大小 规格书
25页 639K
描述
512K x 36, 1M x 18 2.5V Synchronous ZBT⑩ SRAMs 2.5V I/O, Burst Counter Pipelined Outputs

IDT71T75602S150PFI 数据手册

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512K x 36, 1M x 18  
IDT71T75602  
IDT71T75802  
2.5V Synchronous ZBT™ SRAMs  
2.5V I/O, Burst Counter  
PipelinedOutputs  
Features  
Description  
512K x 36, 1M x 18 memory configurations  
The IDT71T75602/802 are 2.5V high-speed 18,874,368-bit  
(18 Megabit)synchronousSRAMs.Theyaredesignedtoeliminatedead  
bus cycles when turning the bus around between reads and writes, or  
Supports high performance system speed - 225 MHz  
(3.0 ns Clock-to-Data Access)  
ZBTTM Feature - No dead cycles between write and read  
TM  
writes andreads.Thus,theyhavebeengiventhenameZBT ,orZero  
Bus Turnaround.  
cycles  
Internally synchronized output buffer enable eliminates the  
Address and control signals are applied to the SRAM during one  
clockcycle,andtwocycles latertheassociateddatacycleoccurs,beit  
read or write.  
need to control OE  
Single R/W (READ/WRITE) control pin  
Positive clock-edge triggered address, data, and control  
TheIDT71T75602/802containdataI/O,addressandcontrolsignal  
registers.Outputenableistheonlyasynchronoussignalandcanbeused  
todisabletheoutputsatanygiventime.  
AClockEnable CEN pinallows operationofthe IDT71T75602/802  
tobesuspendedaslongasnecessary.Allsynchronousinputsareignored  
when(CEN)ishighandtheinternaldeviceregisterswillholdtheirprevious  
values.  
There are three chip enable pins (CE1, CE2, CE2) that allow the  
usertodeselectthedevicewhendesired.Ifanyoneofthesethreeisnot  
assertedwhenADV/LDislow,nonewmemoryoperationcanbeinitiated.  
signal registers for fully pipelined applications  
4-word burst capability (interleaved or linear)  
Individual byte write (BW1 - BW4) control (May tie active)  
Three chip enables for simple depth expansion  
2.5V power supply (±5%)  
2.5V I/O Supply (VDDQ)  
Power down controlled by ZZ input  
Boundary Scan JTAG Interface (IEEE 1149.1 Compliant)  
Packaged in a JEDEC standard 100-pin plastic thin quad  
flatpack (TQFP), 119 ball grid array (BGA)  
PinDescriptionSummary  
A0-A19  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enables  
CE1, CE2, CE2  
OE  
Output Enable  
W
R/  
Read/Write Signal  
Clock Enable  
CEN  
Individual Byte Write Selects  
Clock  
BW1, BW2, BW3, BW4  
CLK  
ADV/LD  
Advance burst address / Load new address  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
Synchronous  
Static  
LBO  
TMS  
N/A  
TDI  
N/A  
TCK  
Test Clock  
N/A  
TDO  
Test Data Input  
N/A  
JTAG Reset (Optional)  
Sleep Mode  
Asynchronous  
Synchronous  
Synchronous  
Static  
TRST  
ZZ  
I/O0-I/O31, I/OP1-I/OP4  
VDD, VDDQ  
Data Input / Output  
Core Power, I/O Power  
Ground  
Supply  
Supply  
VSS  
Static  
5313 tbl 01  
APRIL 2004  
1
©2004IntegratedDeviceTechnology,Inc.  
DSC-5313/08  

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