是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | PLASTIC, QFP-208 | 针数: | 208 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.3 |
Is Samacsys: | N | 最长访问时间: | 15 ns |
其他特性: | FLOW-THROUGH OR PIPELINED ARCHITECTURE | JESD-30 代码: | S-PQFP-G208 |
JESD-609代码: | e0 | 长度: | 28 mm |
内存密度: | 9437184 bit | 内存集成电路类型: | DUAL-PORT SRAM |
内存宽度: | 36 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 208 |
字数: | 262144 words | 字数代码: | 256000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 256KX36 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FQFP |
封装形状: | SQUARE | 封装形式: | FLATPACK, FINE PITCH |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 225 |
认证状态: | Not Qualified | 座面最大高度: | 4.1 mm |
最大供电电压 (Vsup): | 3.45 V | 最小供电电压 (Vsup): | 3.15 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 28 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IDT70V7519S166BC | IDT |
获取价格 |
HIGH-SPEED 3.3V 256K x 36 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7519S166BC8 | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, CMOS, PBGA256, BGA-256 | |
IDT70V7519S166BCG | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, PBGA256, BGA-256 | |
IDT70V7519S166BCG8 | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, PBGA256, BGA-256 | |
IDT70V7519S166BCI | IDT |
获取价格 |
HIGH-SPEED 3.3V 256K x 36 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7519S166BCI8 | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, CMOS, PBGA256, BGA-256 | |
IDT70V7519S166BF | IDT |
获取价格 |
HIGH-SPEED 3.3V 256K x 36 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2. | |
IDT70V7519S166BF8 | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, CMOS, PBGA208, FBGA-208 | |
IDT70V7519S166BFG | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, PBGA208, FBGA-208 | |
IDT70V7519S166BFG8 | IDT |
获取价格 |
Dual-Port SRAM, 256KX36, 12ns, PBGA208, FBGA-208 |