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ICS87008AGI PDF预览

ICS87008AGI

更新时间: 2024-09-26 20:05:19
品牌 Logo 应用领域
艾迪悌 - IDT 驱动光电二极管逻辑集成电路
页数 文件大小 规格书
13页 305K
描述
Low Skew Clock Driver, 87008 Series, 8 True Output(s), 0 Inverted Output(s), PDSO24, 4.40 MM X 7.80 MM , 0.92 MM HEIGHT, MS-153, TSSOP-24

ICS87008AGI 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:4.40 MM X 7.80 MM , 0.92 MM HEIGHT, MS-153, TSSOP-24针数:24
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.52其他特性:CAN ALSO OPERATE WITH 3.3V SUPPLY
系列:87008输入调节:DIFFERENTIAL MUX
JESD-30 代码:R-PDSO-G24JESD-609代码:e0
长度:7.8 mm逻辑集成电路类型:LOW SKEW CLOCK DRIVER
功能数量:1反相输出次数:
端子数量:24实输出次数:8
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
传播延迟(tpd):5.6 ns认证状态:Not Qualified
Same Edge Skew-Max(tskwd):0.15 ns座面最大高度:1.2 mm
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mm最小 fmax:250 MHz
Base Number Matches:1

ICS87008AGI 数据手册

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Integrated Device Technology, Inc.  
6024 Silver Creek Valley Road, San Jose, CA 95138  
PRODUCT/PROCESS CHANGE NOTICE (PCN)  
L-0607-01  
4-Aug-2006  
PCN #:  
DATE:  
MEANS OF DISTINGUISHING CHANGED DEVICES:  
Product Affected:  
Product Mark  
Please see the attached list of the  
affected products shipped in tape and reel  
and in tubes  
Lot shipments will have Level 1  
Back Mark  
Moisture Sensitive Label, and with  
Date Code  
date code "0630".  
Other  
4-Aug-2006  
Date Effective:  
Contact: PS Tow  
Title:  
Phone #: (408) 284- 8206  
Fax #: (408) 284-1450  
Director, PQA  
Attachment:  
Yes  
No  
Please contact your local sales representative for  
sample request & availability.  
Samples:  
E-mail: pstow@idt.com  
DESCRIPTION AND PURPOSE OF CHANGE:  
Die Technology  
This notification is to address discrepancy in moisture sensitivity classification between ICS and IDT  
products after merger. In the old ICS shipping procedure, all surface mount products in tape and reel, and  
in tubes, were shipped in dry pack as MSL 3 irrespective whether the product is MSL1 or MSL 3.  
IDT has completed detail verification of moisture sensitivity classification of all ICS and IDT Products.  
Attachment 1 is the listing of all packages to be coverted to MSL1 and all products in these packages will  
be shipped as MSL1 without dry pack. There will be no mixing of MSL3 and MSL1 in one shipment.  
However, customers may receive shipment of the affected MSL1 products with MSL3 packing until the  
old inventory (previously packed as MSL3) has been depleted.  
Wafer Fabrication Process  
Assembly Process  
Equipment  
Material  
Testing  
Manufacturing Site  
Data Sheet  
Other  
RELIABILITY/QUALIFICATION SUMMARY:  
Moisture report for each package type will be available upon request.  
CUSTOMER ACKNOWLEDGMENT OF RECEIPT:  
IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail  
to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice  
it will be assumed that this change is acceptable.  
IDT reserves the right to ship either version manufactured after the process change effective date until the inventory  
on the earlier version has been depleted.  
Customer:  
Approval for shipments prior to effective date.  
Name/Date:  
E-Mail Address:  
Phone# /Fax# :  
Title:  
CUSTOMER COMMENTS:  
IDT ACKNOWLEDGMENT OF RECEIPT:  
RECD. BY:  
DATE:  
Page 1 of 1  
IDT FRA-1509-01 REV. 00 09/18/01  
Refer To QCA-1795  
Page 1 of 13  

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