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HY57V651620BTC-75 PDF预览

HY57V651620BTC-75

更新时间: 2024-11-05 22:36:35
品牌 Logo 应用领域
海力士 - HYNIX 存储内存集成电路光电二极管ISM频段动态存储器时钟
页数 文件大小 规格书
12页 83K
描述
4 Banks x 1M x 16Bit Synchronous DRAM

HY57V651620BTC-75 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSOP54,.46,32针数:54
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.83
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:5.4 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PDSO-G54
JESD-609代码:e6长度:22.22 mm
内存密度:67108864 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:54
字数:4194304 words字数代码:4000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP54,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
电源:3.3 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:YES连续突发长度:1,2,4,8,FP
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.2 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN BISMUTH
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

HY57V651620BTC-75 数据手册

 浏览型号HY57V651620BTC-75的Datasheet PDF文件第2页浏览型号HY57V651620BTC-75的Datasheet PDF文件第3页浏览型号HY57V651620BTC-75的Datasheet PDF文件第4页浏览型号HY57V651620BTC-75的Datasheet PDF文件第5页浏览型号HY57V651620BTC-75的Datasheet PDF文件第6页浏览型号HY57V651620BTC-75的Datasheet PDF文件第7页 
HY57V651620B  
4 Banks x 1M x 16Bit Synchronous DRAM  
DESCRIPTION  
T h e H y n i x H Y 5 7 V 6 4 1 6 2 0 H G i s a 6 7 , 1 0 8 , 8 6 4 - b i t C M O S S y n c h r o n o u s D R A M , i d e a l l y s u i t e d f o r t h e m a i n m e m o r y a p p l i c a t i o n s w h i c h  
require large memory density and high bandwidth. HY57V641620HG is organized as 4banks of 1, 048, 576x16.  
HY57V641620HG is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchro-  
nized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input a n d o u t p u t  
voltage levels are compatible with LVTTL.  
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated  
by a single control command (Burst length of 1, 2, 4, 8 or Full page), and the burst count sequence(sequential or interleave). A burst of  
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst  
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)  
FEATURES  
Auto refresh and self refresh  
Single 3. 3± 0 . 3 V p o w e r s u p p l y N o t e )  
4096 refresh cycles / 64ms  
All device pins are compatible with LVTTL interface  
Programmable Burst Length and Burst Type  
- 1, 2, 4, 8 or Full page for Sequential Burst  
- 1, 2, 4 or 8 for Interleave Burst  
J E D E C s t a n d a r d 4 0 0 m i l 5 4 p i n T S O P - I I w i t h 0 . 8 m m  
of pin pitch  
All inputs and outputs referenced to positive edge of  
system clock  
P r o g r a m m a b l e C A S Latency ; 2, 3 Clocks  
D a t a m a s k f u n c t i o n b y U D Q M o r L D Q M  
Internal four banks operation  
ORDERING INFORMATION  
Part No.  
Clock Frequency  
Power  
Organization  
Interface  
Package  
H Y 5 7 V 6 5 1 6 2 0 B T C - 5 5  
H Y 5 7 V 6 5 1 6 2 0 B T C - 6  
H Y 5 7 V 6 5 1 6 2 0 B T C - 7  
H Y 5 7 V 6 5 1 6 2 0 B T C - 7 5  
H Y 5 7 V 6 5 1 6 2 0 B T C - 8  
H Y 5 7 V 6 5 1 6 2 0 B T C - 1 0 P  
H Y 5 7 V 6 5 1 6 2 0 B T C - 1 0 S  
H Y 5 7 V 6 5 1 6 2 0 B T C - 1 0  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 5 5  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 6  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 7  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 7 5  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 8  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 1 0 P  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 1 0 S  
H Y 5 7 V 6 5 1 6 2 0 B L T C - 1 0  
1 8 3 M H z  
1 6 6 M H z  
1 4 3 M H z  
1 3 3 M H z  
1 2 5 M H z  
1 0 0 M H z  
1 0 0 M H z  
1 0 0 M H z  
1 8 3 M H z  
1 6 6 M H z  
1 4 3 M H z  
1 3 3 M H z  
1 2 5 M H z  
1 0 0 M H z  
1 0 0 M H z  
1 0 0 M H z  
N o r m a l  
4 B a n k s x 1 M b i t s  
x 1 6  
4 0 0 m i l 5 4 p i n T S O P I I  
L V T T L  
L o w p o w e r  
N o t e : V D D ( M i n ) o f H Y 5 7 V 6 5 1 6 2 0 B ( L ) T C - 5 5 / 6 / 7 i s 3 . 1 3 5 V  
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any responsibility for use of  
circuits described. No patent licenses are implied.  
R e v . 1 . 9 / A p r . 0 1  

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