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HUF76009P3 PDF预览

HUF76009P3

更新时间: 2024-11-05 22:31:35
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英特矽尔 - INTERSIL 晶体晶体管开关局域网
页数 文件大小 规格书
11页 237K
描述
20A, 20V, 0.027 Ohm, N-Channel, Logic Level Power MOSFETs

HUF76009P3 数据手册

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HUF76009P3, HUF76009D3S  
TM  
Data Sheet  
April 2000  
File Number 4861.1  
20A, 20V, 0.027 Ohm, N-Channel, Logic  
Level Power MOSFETs  
THE HUF76009 is an application-specific MOSFET  
optimized for switching when used as the upper switch in  
synchronous buck applications. The low gate charge and low  
input capacitance results in lower driver and lower switching  
losses thereby increasing the overall system efficiency.  
Features  
• 20A, 20V  
- r  
- r  
= 0.027Ω, VGS = 10V  
= 0.039Ω, VGS = 5V  
DS(ON)  
DS(ON)  
Symbol  
D
• PWM optimized for synchronous buck applications  
• Fast Switching  
G
• Low Gate Charge  
- Q Total 11nC (Typ)  
g
S
• Low Capacitance  
- C  
- C  
470pF (Typ)  
ISS  
Packaging  
50pF (Typ)  
RSS  
HUF76009D3S  
HUFD76009P3  
JEDEC TODD2AA  
JEDEC TO-220AB  
Ordering Information  
SOURCE  
DRAIN  
GATE  
DRAIN (FLANGE)  
PART NUMBER  
PACKAGE  
BRAND  
76009P  
76009D  
HUF76009P3  
TO-220AB  
TO-252AA  
HUF76009D3S  
GATE  
SOURCE  
NOTE: When ordering, use the entire part number. Add the suffix T to  
obtain the HUF76009D3S in tape and reel, e.g., HUF76009D3ST.  
DRAIN  
(FLANGE)  
o
Absolute Maximum Ratings  
T
= 25 C, Unless Otherwise Specified  
C
HUF76009P3,  
SYMBOL  
PARAMETER  
HUF76009D3S  
UNITS  
V
Drain to Source Voltage (Note 1)  
20  
20  
V
V
V
DSS  
V
Drain to Gate Voltage (R = 20k) (Note 1)  
GS  
DGR  
V
Gate to Source Voltage  
±16  
GS  
Drain Current  
o
I
I
Continuous (T = 25 C, V = 10V) (Figure 2)  
GS  
20  
16  
Figure 4  
A
A
A
D
D
C
o
Continuous (T = 100 C, V  
= 5V)  
C
GS  
I
Pulsed Drain Current  
Power Dissipation  
DM  
P
41  
0.33  
W
D
o
o
Derate Above 25 C  
W/ C  
o
T , T  
STG  
Operating and Storage Temperature  
-55 to 150  
C
J
Maximum Temperature for Soldering  
o
T
T
Leads at 0.063in (1.6mm) from Case for 10s  
Package Body for 10s, See Techbrief TB334  
300  
260  
C
C
L
o
pkg  
THERMAL SPECIFICATIONS  
o
R
R
Thermal Resistance Junction to Case, TO-220, TO-252  
Thermal Resistance Junction to Ambient TO-220  
Thermal Resistance Junction to Ambient TO-252  
3.04  
62  
C/W  
θJC  
o
C/W  
θJA  
o
100  
C/W  
NOTE:  
o
o
1. T = 25 C to 125 C.  
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.  
1
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000  
UltraFET® is a registered trademark of Intersil Corporation.  

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