HUF76009P3, HUF76009D3S
TM
Data Sheet
April 2000
File Number 4861.1
20A, 20V, 0.027 Ohm, N-Channel, Logic
Level Power MOSFETs
THE HUF76009 is an application-specific MOSFET
optimized for switching when used as the upper switch in
synchronous buck applications. The low gate charge and low
input capacitance results in lower driver and lower switching
losses thereby increasing the overall system efficiency.
Features
• 20A, 20V
- r
- r
= 0.027Ω, VGS = 10V
= 0.039Ω, VGS = 5V
DS(ON)
DS(ON)
Symbol
D
• PWM optimized for synchronous buck applications
• Fast Switching
G
• Low Gate Charge
- Q Total 11nC (Typ)
g
S
• Low Capacitance
- C
- C
470pF (Typ)
ISS
Packaging
50pF (Typ)
RSS
HUF76009D3S
HUFD76009P3
JEDEC TODD2AA
JEDEC TO-220AB
Ordering Information
SOURCE
DRAIN
GATE
DRAIN (FLANGE)
PART NUMBER
PACKAGE
BRAND
76009P
76009D
HUF76009P3
TO-220AB
TO-252AA
HUF76009D3S
GATE
SOURCE
NOTE: When ordering, use the entire part number. Add the suffix T to
obtain the HUF76009D3S in tape and reel, e.g., HUF76009D3ST.
DRAIN
(FLANGE)
o
Absolute Maximum Ratings
T
= 25 C, Unless Otherwise Specified
C
HUF76009P3,
SYMBOL
PARAMETER
HUF76009D3S
UNITS
V
Drain to Source Voltage (Note 1)
20
20
V
V
V
DSS
V
Drain to Gate Voltage (R = 20kΩ) (Note 1)
GS
DGR
V
Gate to Source Voltage
±16
GS
Drain Current
o
I
I
Continuous (T = 25 C, V = 10V) (Figure 2)
GS
20
16
Figure 4
A
A
A
D
D
C
o
Continuous (T = 100 C, V
= 5V)
C
GS
I
Pulsed Drain Current
Power Dissipation
DM
P
41
0.33
W
D
o
o
Derate Above 25 C
W/ C
o
T , T
STG
Operating and Storage Temperature
-55 to 150
C
J
Maximum Temperature for Soldering
o
T
T
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
300
260
C
C
L
o
pkg
THERMAL SPECIFICATIONS
o
R
R
Thermal Resistance Junction to Case, TO-220, TO-252
Thermal Resistance Junction to Ambient TO-220
Thermal Resistance Junction to Ambient TO-252
3.04
62
C/W
θJC
o
C/W
θJA
o
100
C/W
NOTE:
o
o
1. T = 25 C to 125 C.
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1
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