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HUF75337S3S PDF预览

HUF75337S3S

更新时间: 2024-11-28 22:48:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关
页数 文件大小 规格书
10页 225K
描述
75A, 55V, 0.014 Ohm, N-Channel UltraFET Power MOSFETs

HUF75337S3S 技术参数

是否Rohs认证:符合生命周期:Obsolete
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.15Is Samacsys:N
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (Abs) (ID):75 A
最大漏极电流 (ID):75 A最大漏源导通电阻:0.014 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):175 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

HUF75337S3S 数据手册

 浏览型号HUF75337S3S的Datasheet PDF文件第2页浏览型号HUF75337S3S的Datasheet PDF文件第3页浏览型号HUF75337S3S的Datasheet PDF文件第4页浏览型号HUF75337S3S的Datasheet PDF文件第5页浏览型号HUF75337S3S的Datasheet PDF文件第6页浏览型号HUF75337S3S的Datasheet PDF文件第7页 
HUF75337G3, HUF75337P3, HUF75337S3S  
Data Sheet  
December 2001  
75A, 55V, 0.014 Ohm, N-Channel UltraFET  
Power MOSFETs  
Features  
• 75A, 55V  
These N-Channel power MOSFETs  
are manufactured using the  
innovative UltraFET® process. This  
• Simulation Models  
- Temperature Compensated PSPICE® and SABER™  
Models  
advanced process technology  
- SPICE and SABER Thermal Impedance Models  
Available on the web at: www.fairchildsemi.com  
achieves the lowest possible on-resistance per silicon area,  
resulting in outstanding performance. This device is capable  
of withstanding high energy in the avalanche mode and the  
diode exhibits very low reverse recovery time and stored  
charge. It was designed for use in applications where power  
efficiency is important, such as switching regulators,  
switching converters, motor drivers, relay drivers, low-  
voltage bus switches, and power management in portable  
and battery-operated products.  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
• Related Literature  
- TB334, “Guidelines for Soldering Surface Mount  
Components to PC Boards”  
Symbol  
Formerly developmental type TA75337.  
D
Ordering Information  
PART NUMBER  
PACKAGE  
BRAND  
75337G  
G
HUF75337G3  
TO-247  
HUF75337P3  
TO-220AB  
TO-263AB  
75337P  
75337S  
S
HUF75337S3S  
NOTE: When ordering, use the entire part number. Add the suffix T to  
obtain the TO-263AB variant in tape and reel, e.g., HUF75337S3ST.  
Packaging  
JEDEC STYLE TO-247  
JEDEC TO-220AB  
SOURCE  
DRAIN  
GATE  
SOURCE  
DRAIN  
GATE  
DRAIN  
(FLANGE)  
DRAIN  
(TAB)  
JEDEC TO-263AB  
DRAIN  
(FLANGE)  
GATE  
SOURCE  
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html  
For severe environments, see our Automotive HUFA series.  
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.  
©2001 Fairchild Semiconductor Corporation  
HUF75337G3, HUF75337P3, HUF75337S3S Rev. B  

HUF75337S3S 替代型号

型号 品牌 替代类型 描述 数据表
FDB13AN06A0 FAIRCHILD

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