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HSK1118 PDF预览

HSK1118

更新时间: 2024-01-08 02:17:53
品牌 Logo 应用领域
HSMC /
页数 文件大小 规格书
5页 64K
描述
Silicon N Channel MOS Type

HSK1118 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:NBase Number Matches:1

HSK1118 数据手册

 浏览型号HSK1118的Datasheet PDF文件第1页浏览型号HSK1118的Datasheet PDF文件第2页浏览型号HSK1118的Datasheet PDF文件第3页浏览型号HSK1118的Datasheet PDF文件第4页 
Spec. No. : Preliminary Data  
Issued Date : 1998.02.01  
Revised Date : 1999.08.01  
Page No. : 5/5  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-220AB Dimension  
Marking :  
A
B
H
D
E
C
HSMC Logo  
Part Number  
Date Code  
Product Series  
Rank  
Style : Pin 1.Gate 2.Drain 3.Source  
K
M
I
3
N
G
2
1
4
P
O
3-Lead TO-220AB Plastic Package  
HSMC Package Code : E  
*:Typical  
Inches  
Min. Max.  
0.2197 0.2949  
0.3299 0.3504  
Millimeters  
Min. Max.  
Inches  
Millimeters  
DIM  
DIM  
Min.  
Max.  
Min.  
-
0.75  
1.14  
-
Max.  
*3.83  
0.95  
A
B
C
D
E
G
H
5.58  
8.38  
4.40  
1.15  
0.35  
9.66  
-
7.49  
8.90  
4.70  
1.39  
0.60  
I
-
*0.1508  
0.0295 0.0374  
0.0449 0.0551  
*0.1000  
0.5000 0.5618  
0.5701 0.6248  
K
M
N
O
P
0.1732  
0.185  
1.40  
0.0453 0.0547  
0.0138 0.0236  
0.3803 0.4047  
-
*2.54  
14.27  
15.87  
12.70  
14.48  
10.28  
*16.25  
-
*0.6398  
Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.  
2.Controlling dimension : millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory :  
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454  
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5983621~5 Fax : 886-3-5982931  
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5977061 Fax : 886-3-5979220  
HSMC Product Specification  

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