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HSCH-5511 PDF预览

HSCH-5511

更新时间: 2024-11-11 20:56:23
品牌 Logo 应用领域
安捷伦 - AGILENT 脉冲二极管
页数 文件大小 规格书
6页 71K
描述
Mixer Diode, Medium Barrier, K Band, Silicon

HSCH-5511 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:R-MTMW-F3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.60
风险等级:5.35配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
最大二极管电容:0.1 pF二极管元件材料:SILICON
二极管类型:MIXER DIODE最大正向电压 (VF):0.5 V
频带:K BANDJESD-30 代码:R-MTMW-F3
JESD-609代码:e0元件数量:2
端子数量:3最高工作温度:175 °C
封装主体材料:METAL封装形状:RECTANGULAR
封装形式:MICROWAVE脉冲输入最大功率:0.15 W
脉冲输入功率最小值:1 W认证状态:Not Qualified
子类别:Rectifier Diodes表面贴装:YES
技术:SCHOTTKY端子面层:Tin/Lead (Sn/Pb)
端子形式:FLAT端子位置:TRIPLE
肖特基势垒类型:MEDIUM BARRIERBase Number Matches:1

HSCH-5511 数据手册

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Beam Lead Schottky Diode  
Pairs for Mixers and Detectors  
Technical Data  
HSCH-5500 Series  
Features  
• Monolithic Pair  
Closely Matched Electrical  
Parameters  
Outline 04B  
540 (21.0)  
480 (19.0)  
220 (9.0)  
180 (7.0)  
220 (9.0)  
180 (6.0)  
• Low Capacitance  
CATHODE  
0.1 pF Maximum at 0 Volts  
120 (5.0)  
90 (3.5)  
250 (10.0)  
200 (8.0)  
• Low Noise Figure  
Typical 7.5 dB at 26 GHz  
GOLD  
BEAMS  
• Rugged Construction  
190 (7.0)  
160 (6.0)  
GLASS  
4 Grams Minimum Lead Pull  
• Platinum Tri-Metal System  
12 (0.5)  
8 (0.3)  
High Temperature Stability  
• Polyimide Scratch Protection  
• Silicon Nitride Passivation  
Stable, Reliable Performance  
GLASS  
60 (2.4)  
40 (1.5)  
PLATINUM  
METALLIZATION  
Description  
CATHODE  
ANODE  
These dual beam lead diodes are  
constructed using a metal-  
semiconductor Schottky barrier  
junction. Advanced epitaxial  
techniques and precise process  
control insure uniformity and  
repeatability of this planar  
COMMON  
DIMENSIONS IN µm (1/1000 inch)  
Maximum Ratings ( for Each Diode)  
Pulse Power Incident at TA = 25°C ..........................................................1 W  
passivated microwave semicon-  
ductor. A nitride passivation layer  
provides immunity from  
Pulse Width = 1 µs, Du = 0.001  
CW Power Dissipation at TA = 25°C ................................................ 150 mW  
Measured in an infinite heat sink derated linearly  
contaminants which could  
otherwise lead to IR drift.  
to zero at maximum rated temperature  
TOPR – Operating Temperature Range ...............................-65°C to +175 °C  
TSTG – Storage Temperature Range ....................................-65°C to +200°C  
Minimum Lead Strength ........................................ 4 grams pull on any lead  
Diode Mounting Temperature ................................. 350°C for 10 sec. max.  
The Agilent beam lead process  
allows for large beam anchor pads  
for rugged construction (typical 6  
gram pull strength) without  
degrading capacitance.  
These diodes are ESD sensitive. Handle with care to avoid static  
discharge through the diode.  

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