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HSCH-5341 PDF预览

HSCH-5341

更新时间: 2024-11-11 03:42:51
品牌 Logo 应用领域
安捷伦 - AGILENT 肖特基二极管微波混频二极管脉冲
页数 文件大小 规格书
6页 76K
描述
Beam Lead Schottky Diodes for Mixers and Detectors (1 - 26 GHz)

HSCH-5341 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:R-LDMW-F2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.60
风险等级:5.35Is Samacsys:N
配置:SINGLE最大二极管电容:0.1 pF
二极管元件材料:SILICON二极管类型:MIXER DIODE
频带:L BAND TO K BAND最大阻抗:350 Ω
最小阻抗:150 ΩJESD-30 代码:R-LDMW-F2
JESD-609代码:e0最大噪声指数:7.5 dB
元件数量:1端子数量:2
最高工作温度:175 °C封装主体材料:GLASS
封装形状:RECTANGULAR封装形式:MICROWAVE
脉冲输入最大功率:0.15 W脉冲输入功率最小值:1 W
认证状态:Not Qualified子类别:Microwave Mixer Diodes
表面贴装:YES技术:SCHOTTKY
端子面层:Tin/Lead (Sn/Pb)端子形式:FLAT
端子位置:DUAL肖特基势垒类型:LOW BARRIER
Base Number Matches:1

HSCH-5341 数据手册

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Beam Lead Schottky Diodes for  
Mixers and Detectors  
( 1– 26 GHz)  
Technical Data  
HSCH-5300 Series  
Features  
Outline 07  
• Platinum Tri-Metal System  
CATHODE  
GOLD LEADS  
High Temperature Stability  
130 (5)  
100 (4)  
• Silicon Nitride Passivation  
Stable, Reliable Performance  
135 (5)  
90 (3)  
• Low Noise Figure  
Guaranteed 7.5 dB at 26 GHz  
135 (5)  
90 (3)  
• High Uniformity  
Tightly Controlled Process  
Insures Uniform RF  
Characteristics  
225 (9)  
200 (8)  
310 (12)  
250 (10)  
225 (9)  
170 (7)  
• Rugged Construction  
4 Grams Minimum Lead Pull  
12 (.5)  
8 (.3)  
• Low Capacitance  
30 MIN (1)  
0.10 pF Max. at 0 V  
• Polyimide Scratch Protection  
SILICON  
GLASS  
710 (28)  
670 (26)  
60 (2)  
40 (1)  
Description  
These beam lead diodes are  
constructed using a metal-  
semiconductor Schottky barrier  
junction. Advanced epitaxial  
techniques and precise process  
control insure uniformity and  
repeatability of this planar  
passivated microwave semicon-  
ductor. A nitride passivation layer  
provides immunity from  
DIMENSIONS IN µm (1/1000 inch)  
Maximum Ratings  
Pulse Power Incident at TA = 25°C ..........................................................1 W  
Pulse Width = 1 µs, Du = 0.001  
CW Power Dissipation at TA = 25°C ................................................ 150 mW  
Measured in an infinite heat sink derated linearly  
to zero at maximum rated temperature  
contaminants which could  
otherwise lead to IR drift.  
TOPR – Operating Temperature Range ...............................-65°C to +175 °C  
TSTG – Storage Temperature Range ....................................-65°C to +200°C  
Minimum Lead Strength ........................................ 4 grams pull on any lead  
Diode Mounting Temperature ............................... +350°C for 10 sec. max.  
The Agilent beam lead process  
allows for large beam anchor pads  
for rugged construction (typical  
6 gram pull strength) without  
degrading capacitance.  
These diodes are ESD sensitive. Handle with care to avoid static  
discharge through the diode.  

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