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HMS8N50I PDF预览

HMS8N50I

更新时间: 2024-09-16 01:22:47
品牌 Logo 应用领域
华之美 - HMSEMI /
页数 文件大小 规格书
7页 935K
描述
500V N-Channel MOSFET

HMS8N50I 数据手册

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HMS8N50K/HMS8N50I  
HMS8N50K/HMS8N50I  
500V N-Channel MOSFET  
General Description  
Features  
This Power MOSFET is produced using H&M Semi’s  
Advanced Super-Junction technology.  
This advanced technology has been especially tailored  
to minimize conduction loss, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode.  
- 7.6A, 500V, RDS(on) typ. = 0.5Ω@VGS = 10 V  
- Low gate charge ( typical 25nC)  
- High ruggedness  
- Fast switching  
- 100% avalanche tested  
- Improved dv/dt capability  
These devices are well suited for AC/DC power conversion  
in switching mode operation for higher efficiency.  
D
D
I-PAK  
D-PAK  
G
G
S
G D S  
S
Absolute Maximum Ratings  
TC = 25°C unless otherwise noted  
Symbol  
Parameter  
HMS8N50K/HMS8N50I  
Units  
Drain-Source Voltage  
500  
V
VDSS  
Drain Current  
- Continuous (TC = 25)  
- Continuous (TC = 100)  
- Pulsed  
7.6*  
A
A
ID  
5*  
10  
IDM  
(Note 1)  
Drain Current  
A
VGSS  
Gate-Source Voltage  
±30  
V
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
86  
mJ  
A
1.7  
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Power Dissipation (TC = 25)  
43  
mJ  
V/ns  
W
dv/dt  
4.5  
57  
PD  
- Derate above 25℃  
0.45  
-55 to +150  
W/℃  
TJ, TSTG  
Operating and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
TL  
300  
1/8" from case for 5 seconds  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
HMS8N50K/HMS8N50I  
Units  
Thermal Resistance, Junction-to-Case  
2.2  
/W  
RθJC  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
0.5  
62  
/W  
/W  
RθJS  
RθJA  

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