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HMP564F7FFP8C-Y5D3 PDF预览

HMP564F7FFP8C-Y5D3

更新时间: 2024-09-17 21:04:35
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
26页 626K
描述
DDR DRAM, 64MX72, CMOS, ROHS COMPLIANT, DIMM-240

HMP564F7FFP8C-Y5D3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM240,40针数:240
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.36风险等级:5.84
访问模式:SINGLE BANK PAGE BURST其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):333 MHzI/O 类型:COMMON
JESD-30 代码:R-XDMA-N240内存密度:4831838208 bit
内存集成电路类型:DDR DRAM内存宽度:72
功能数量:1端口数量:1
端子数量:240字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:95 °C最低工作温度:
组织:64MX72输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM240,40封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):260
电源:1.5,1.8 V认证状态:Not Qualified
刷新周期:8192自我刷新:YES
子类别:Other Memory ICs最大供电电压 (Vsup):1.575 V
最小供电电压 (Vsup):1.455 V标称供电电压 (Vsup):1.5 V
表面贴装:NO技术:CMOS
温度等级:OTHER端子形式:NO LEAD
端子节距:1 mm端子位置:DUAL
处于峰值回流温度下的最长时间:20Base Number Matches:1

HMP564F7FFP8C-Y5D3 数据手册

 浏览型号HMP564F7FFP8C-Y5D3的Datasheet PDF文件第2页浏览型号HMP564F7FFP8C-Y5D3的Datasheet PDF文件第3页浏览型号HMP564F7FFP8C-Y5D3的Datasheet PDF文件第4页浏览型号HMP564F7FFP8C-Y5D3的Datasheet PDF文件第5页浏览型号HMP564F7FFP8C-Y5D3的Datasheet PDF文件第6页浏览型号HMP564F7FFP8C-Y5D3的Datasheet PDF文件第7页 
240pin Fully Buffered DDR2 SDRAM DIMMs based on 512 Mb F-ver.  
This Hynix’s Fully Buffered DIMM is a high-bandwidth & large capacity channel solution that has a narrow  
host interface. Hynix’s FB-DIMM features novel architecture including the Advanced Memory Buffer that  
isolates the DDR2 SDRAMs from the channel. This single component located in the front side center of  
each DIMM, acts as a repeater and buffer for all signals and commands which are exchanged between the  
host controller and the DDR2 SDRAMs including data in and output. The AMB communicates with the host  
controller and adjacent DIMMs on a system board using an industry standard Differential Point to Point  
Link Interface at 1.5V power.  
The AMB also allows buffering of memory traffic to support large memory capacities. All memory control  
for the DDR2 SDRAM devices resides in the host, including memory request initiation, timing, refresh,  
scrubbing, sparing, configuration access and power management. The AMB interface is responsible for  
handling channel and memory requests to and from the local FBDIMM and for forwarding request to other  
FBDIMMs on the memory channel.  
FEATURES  
240 pin Fully Buffered ECC dual In-Line DDR2 SDRAM Module  
JEDEC standard Double Data Rate2 Synchronous DRAMs (DDR2 SDRAMs) with 1.8V +/- 0.1V Power Supply  
All inputs and outputs are compatible with SSTL_1.8 interface  
Built with 512Mb DDR2 SDRAMs in 60ball FBGA  
Host interface and AMB component industry standard compliant  
MBIST & IBIST test functions  
4 Bank architecture  
OCD (Off-Chip Driver Impedance Adjustment)  
ODT (On-Die Termination)  
Fully differential clock operations (CK & CK)  
Programmable Burst Length 4 / 8 with both sequential and interleave mode  
Auto refresh and self refresh supported  
8192 refresh cycles / 64ms  
Serial presence detect with EEPROM  
133.35 x 30.35 mm form factor  
RoHS compliant  
Full Module Heat Spreader  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev 1.2 / Feb. 2009  
1

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