Datasheet > HMCAA132G

HMCAA132G

更新时间： 2024-11-21 05:36:15

品牌	Logo	应用领域
ADAM-TECH		/
页数	文件大小	规格书
1页	110K
描述
HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)

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HMCAA132G 数据手册

HIGH DENSITY CARD EDGE

.050" [1.27] VESA MICRO CHANNEL

ARCHITECTURE (MCA)

Adam Technologies, Inc.

HMCA SERIES

INTRODUCTION:

Adam Tech HMCA Series Card Edge Connectors include Standard

and Express versions designed for PCB’s in Peripheral Component

Interconnect (PCI) applications. Each is manufactured in a four row,

high density package which is completely compatible to industry

standards and has specially engineered contacts which provide a

very short electrical path between boards. Adam Tech card edge

connectors are designed for high performance with solid board pegs

and precision located, selectively gold plated contacts which are

ideal in high speed, increased bandwidth applications

FEATURES:

PCI and PCI Express Versions

High density compact designs

Industry standard PCI compatible

Special contact design reduces electrical path

Selectively plated contacts

Open bottom for after solder cleaning

MATING PC BOARDS:

All .050" centerline printed circuit board pads with a thickness of

.062" to .072"

SPECIFICATIONS:

Material:

Standard insulator: PPS, 30% glass reinforced, rated UL94V-0

Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0

Insulator Color: Dark Brown (White 120 pos.)

Contacts: Phosphor Bronze

ORDERING INFORMATION

HMCA

112

Contact Plating:

Gold Flash (30 µin Optional) over Nickel underplate on contact area,

tin over copper underplate on tails.

Electrical:

Operating voltage: 125V AC max.

Current rating: 1 Amp max.

Contact resistance: 30 mΩ max. initial

Insulation resistance: 1000 MΩ min.

Dielectric withstanding voltage: 500V AC for 1 minute

Mechanical:

PLATING

SERIES INDICATOR

HMCA=

VESA Micro-channel

G = Selectively

gold plated

contacts

Card Edge connector

Insertion force: 7 oz max.

Withdrawal force: 0.9 oz min

Temperature Rating:

Operating temperature: -55°C to +105°C

Soldering process temperature:

Standard insulator: 235°C

PEGS =

A = Plastic pegs

B = Metal boardlocks

Hi-Temp insulator: 260°C

POSITIONS

112, 120, 132, 182, 184, 194

PACKAGING:

Anti-ESD plastic trays

SAFETY AGENCY APPROVALS:

UL Recognized File No. E224053

CSA Certified File No. LR1578596

OPTIONS

HI-TEMP

RoHS

A V A I L A B L E

Add designator(s) to end of part number

30 = 30 µin gold plating in contact area

HT = Hi-Temp insulator for Hi-Temp soldering

processes up to 260°C

INSULATOR

COMPLIANT

2002 / 95 / EC

909 Rahway Avenue • Union, New Jersey 07083 • T: 908-687-5000 • F: 908-687-5710 • WWW.ADAM-TECH.COM

172

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与HMCAA132G相关器件

型号	品牌	获取价格	描述	数据表
HMCAA182G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)
HMCA-A-182-G	ADAM-TECH	获取价格	VESA Micro-Channel
HMCAA184G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)
HMCA-A-184-G	ADAM-TECH	获取价格	VESA Micro-Channel
HMCAA194G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)
HMCA-A-XXX-G	ADAM-TECH	获取价格	VESA Micro-Channel
HMCAB112G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)
HMCAB120G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)
HMCAB132G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)
HMCAB182G	ADAM-TECH	获取价格	HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)

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