生命周期: | Contact Manufacturer | Reach Compliance Code: | compliant |
风险等级: | 5.77 | 板上安装选件: | PEG |
主体深度: | 0.61 inch | 主体长度: | 4.89 inch |
连接器类型: | CARD EDGE CONNECTOR | 联系完成配合: | AU ON NI |
触点材料: | PHOSPHOR BRONZE | 触点模式: | RECTANGULAR |
触点电阻: | 30 m Ω | 触点样式: | BELLOWED TYPE |
介电耐压: | 500VAC V | 绝缘电阻: | 1000000000 Ω |
绝缘体材料: | GLASS FILLED POLYPHENYLENE SULPHIDE | 插接触点节距: | 0.05 inch |
安装选项1: | LOCKING | 安装方式: | STRAIGHT |
安装类型: | BOARD | 连接器数: | ONE |
PCB行数: | 4 | 装载的行数: | 2 |
最高工作温度: | 105 °C | 最低工作温度: | -55 °C |
PCB接触模式: | STAGGERED | PCB触点行间距: | 2.54 mm |
额定电流(信号): | 1 A | 参考标准: | UL, CSA |
可靠性: | COMMERCIAL | 子类别: | Headers and Edge Type Connectors |
端子长度: | 0.118 inch | 端子节距: | 2.54 mm |
端接类型: | SOLDER | 触点总数: | 182 |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HMCAB184G | ADAM-TECH |
获取价格 |
HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA) | |
HMCAB194G | ADAM-TECH |
获取价格 |
HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA) | |
HMC-ABH209 | HITTITE |
获取价格 |
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz | |
HMC-ABH209_09 | HITTITE |
获取价格 |
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz | |
HMC-ABH209-Die | ADI |
获取价格 |
中等功率放大器芯片,55 - 65 GHz | |
HMC-ABH241 | HITTITE |
获取价格 |
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz | |
HMC-ABH241_0712 | HITTITE |
获取价格 |
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz | |
HMC-ABH241_09 | HITTITE |
获取价格 |
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz | |
HMC-ABH241-Die | ADI |
获取价格 |
中等功率放大器芯片,50 - 66 GHz | |
HMC-ABH264 | HITTITE |
获取价格 |
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 34 - 42 GHz |