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HMCAB112G

更新时间： 2024-01-12 01:30:04
品牌 Logo 应用领域
ADAM-TECH /
页数 文件大小 规格书
1页 110K
描述
HIGH DENSITY CARD EDGE .050 [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA)

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HMCAB112G 技术参数

生命周期：Contact ManufacturerReach Compliance Code：compliant
风险等级：5.77板上安装选件：PEG
主体深度：0.61 inch主体长度：3.14 inch
连接器类型：CARD EDGE CONNECTOR联系完成配合：AU ON NI
触点材料：PHOSPHOR BRONZE触点模式：RECTANGULAR
触点电阻：30 m Ω触点样式：BELLOWED TYPE
介电耐压：500VAC V绝缘电阻：1000000000 Ω
绝缘体材料：GLASS FILLED POLYPHENYLENE SULPHIDE插接触点节距：0.05 inch
安装选项1：LOCKING安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：4装载的行数：2
最高工作温度：105 °C最低工作温度：-55 °C
PCB接触模式：STAGGEREDPCB触点行间距：2.54 mm
额定电流（信号）：1 A参考标准：UL, CSA
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子长度：0.118 inch端子节距：2.54 mm
端接类型：SOLDER触点总数：112
Base Number Matches：1

HMCAB112G 数据手册

  
HIGH DENSITY CARD EDGE  
.050" [1.27] VESA MICRO CHANNEL  
ARCHITECTURE (MCA)  
Adam Technologies, Inc.  
HMCA SERIES  
INTRODUCTION:  
Adam Tech HMCA Series Card Edge Connectors include Standard  
and Express versions designed for PCB’s in Peripheral Component  
Interconnect (PCI) applications. Each is manufactured in a four row,  
high density package which is completely compatible to industry  
standards and has specially engineered contacts which provide a  
very short electrical path between boards. Adam Tech card edge  
connectors are designed for high performance with solid board pegs  
and precision located, selectively gold plated contacts which are  
ideal in high speed, increased bandwidth applications  
FEATURES:  
PCI and PCI Express Versions  
High density compact designs  
Industry standard PCI compatible  
Special contact design reduces electrical path  
Selectively plated contacts  
Open bottom for after solder cleaning  
MATING PC BOARDS:  
All .050" centerline printed circuit board pads with a thickness of  
.062" to .072"  
SPECIFICATIONS:  
Material:  
Standard insulator: PPS, 30% glass reinforced, rated UL94V-0  
Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0  
Insulator Color: Dark Brown (White 120 pos.)  
Contacts: Phosphor Bronze  
ORDERING INFORMATION  
HMCA  
A
112  
G
Contact Plating:  
Gold Flash (30 µin Optional) over Nickel underplate on contact area,  
tin over copper underplate on tails.  
Electrical:  
Operating voltage: 125V AC max.  
Current rating: 1 Amp max.  
Contact resistance: 30 mΩ max. initial  
Insulation resistance: 1000 MΩ min.  
Dielectric withstanding voltage: 500V AC for 1 minute  
Mechanical:  
PLATING  
SERIES INDICATOR  
HMCA=  
VESA Micro-channel  
G = Selectively  
gold plated  
contacts  
Card Edge connector  
Insertion force: 7 oz max.  
Withdrawal force: 0.9 oz min  
Temperature Rating:  
Operating temperature: -55°C to +105°C  
Soldering process temperature:  
Standard insulator: 235°C  
PEGS =  
A = Plastic pegs  
B = Metal boardlocks  
Hi-Temp insulator: 260°C  
POSITIONS  
112, 120, 132, 182, 184, 194  
PACKAGING:  
Anti-ESD plastic trays  
SAFETY AGENCY APPROVALS:  
UL Recognized File No. E224053  
CSA Certified File No. LR1578596  
OPTIONS  
Pb  
HI-TEMP  
RoHS  
A V A I L A B L E  
Add designator(s) to end of part number  
30 = 30 µin gold plating in contact area  
HT = Hi-Temp insulator for Hi-Temp soldering  
processes up to 260°C  
®
®
INSULATOR  
COMPLIANT  
2002 / 95 / EC  
909 Rahway Avenue • Union, New Jersey 07083 • T: 908-687-5000 • F: 908-687-5710 • WWW.ADAM-TECH.COM  
172  
1

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