HMC814LC3B
v02.0614
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 13 - 24.6 GHz OUTPUT
Absolute Maximum Ratings
Typical Supply Current vs. Vdd
RF Input (Vdd = +5V)
+10 dBm
Vdd (Vdc)
Idd (mA)
Supply Voltage (Vdd1, Vdd2)
Channel Temperature
+5.5 Vdc
4.5
87
88
89
175 °C
5.0
Continuous Pdiss (T= 85 °C)
(derate 8.3 mW/°C above 85 °C)
5.5
743 mW
Note:
Thermal Resistance
(channel to ground paddle)
121 °C/W
Multiplier will operate over full voltage range shown above.
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
-65 to +150 °C
-40 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Class 0 (Passed 150 V)
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER
50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
Alumina, White
Lead Finish
MSL Rating
Package Marking [2]
H814
XXXX
MSL3 [1]
HMC814LC3B
Gold over Nickel
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
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