Datasheet > HMC462_10

HMC462_10

更新时间： 2022-11-07 16:45:02

品牌	Logo	应用领域
HITTITE		放大器
页数	文件大小	规格书
6页	415K
描述
GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 2 - 20 GHz

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HMC462_10 数据手册

HMC462

v04.1210

GaAs PHEMT MMIC

LOW NOISE AMPLIFIER, 2 - 20 GHz

Outline Drawing

Die Packaging Information ^[1]

noTes:

1. All Dimensions in inChes [millimeTers]

2. no ConneCTion reQUireD for UnlABeleD BonD pADs

3. Die ThiCKness is 0.004 (0.100)

4. TYpiCAl BonD pAD is 0.004 (0.100) sQUAre

5. BACKsiDe meTAlliZATion: GolD

6. BACKsiDe meTAl is GroUnD

staꢊdaꢆd

Aꢉtꢁꢆꢊatꢁ

Gp-2 (Gꢁꢉ pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

7. BonD pAD meTAliZATion: GolD

Pad Descriptions

pad nuꢇbꢁꢆ

fuꢊctꢂꢄꢊ

Dꢁꢃcꢆꢂꢈtꢂꢄꢊ

iꢊtꢁꢆꢋacꢁ scꢀꢁꢇatꢂc

rfin

Tꢀꢂꢃ ꢈad ꢂꢃ AC cꢄuꢈꢉꢁd aꢊd ꢇatcꢀꢁd tꢄ 50 oꢀꢇꢃ.

pꢄꢅꢁꢆ ꢃuꢈꢈꢉy vꢄꢉtagꢁ ꢋꢄꢆ tꢀꢁ aꢇꢈꢉꢂﬁꢁꢆ.

extꢁꢆꢊaꢉ byꢈaꢃꢃ caꢈacꢂtꢄꢆꢃ aꢆꢁ ꢆꢁquꢂꢆꢁd

Vdd

rfoUT

GnD

Tꢀꢂꢃ ꢈad ꢂꢃ AC cꢄuꢈꢉꢁd aꢊd ꢇatcꢀꢁd tꢄ 50 oꢀꢇꢃ.

Dꢂꢁ bꢄttꢄꢇ ꢇuꢃt bꢁ cꢄꢊꢊꢁctꢁd tꢄ rf/DC gꢆꢄuꢊd.

Dꢂꢁ

Bꢄttꢄꢇ

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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