Datasheet > HMBT8550

HMBT8550

更新时间： 2024-01-30 02:50:30

品牌	Logo	应用领域
HSMC		晶体晶体管局域网
页数	文件大小	规格书
3页	33K
描述
PNP EPITAXIAL PLANAR TRANSISTOR

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技术参数
数据手册

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HMBT8550 技术参数

生命周期：	Obsolete	零件包装代码：	SC-59
包装说明：	SMALL OUTLINE, R-PDSO-G3	针数：	3
Reach Compliance Code：	unknown	风险等级：	5.84
Is Samacsys：	N	JESD-30 代码：	R-PDSO-G3
端子数量：	3	封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
认证状态：	Not Qualified	表面贴装：	YES
端子形式：	GULL WING	端子位置：	DUAL
Base Number Matches：	1

HMBT8550 数据手册

Spec. No. : HE6813

Issued Date : 1997.08.11

Revised Date : 2002.10.25

Page No. : 3/3

HI-SINCERITY

MICROELECTRONICS CORP.

SOT-23 Dimension

Marking:

B 9

B S

Rank Code

Control Code

3-Lead SOT-23 Plastic

Surface Mounted Package

HSMC Package Code: N

Style: Pin 1.Base 2.Emitter 3.Collector

*: Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

2.80

1.20

0.89

0.30

1.70

0.013

Max.

3.04

1.60

1.30

0.50

2.30

0.10

Min.

Max.

Min.

Max.

0.177

0.67

1.15

2.75

0.65

0.1102

0.0472

0.0335

0.0118

0.0669

0.0005

0.1204

0.0630

0.0512

0.0197

0.0910

0.0040

0.0034

0.0128

0.0335

0.0830

0.0098

0.0070

0.0266

0.0453

0.1083

0.0256

0.085

0.32

0.85

2.10

0.25

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

HMBT8550

HSMC Product Specification

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