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H5TQ4G63EFR-RDC PDF预览

H5TQ4G63EFR-RDC

更新时间: 2023-12-06 20:02:09
品牌 Logo 应用领域
海力士 - HYNIX 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
33页 1429K
描述
DDR3

H5TQ4G63EFR-RDC 数据手册

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Pin Functional Description  
Symbol  
Type  
Function  
Clock: CK and CK are differential clock inputs. All address and control input signals are  
sampled on the crossing of the positive edge of CK and negative edge of CK.  
CK, CK  
Input  
Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and  
device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down  
and Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any  
bank).  
CKE, (CKE0),  
(CKE1)  
Input CKE is asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable  
during the power on and initialization sequence, they must be maintained during all  
operations (including Self-Refresh). CKE must be maintained high throughout read and  
write accesses. Input buffers, excluding CK, CK, ODT and CKE, are disabled during power-  
down. Input buffers, excluding CKE, are disabled during Self-Refresh.  
Chip Select: All commands are masked when CS is registered HIGH.  
CS provides for external Rank selection on systems with multiple Ranks.  
CS is considered part of the command code.  
CS, (CS0),  
(CS1), (CS2),  
(CS3)  
Input  
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the  
DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS,  
NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x4/x8  
configurations. For x16 configuration, ODT is applied to each DQ, DQSU, DQSU, DQSL,  
DQSL, DMU, and DML signal. The ODT pin will be ignored if MR1 is programmed to disable  
ODT.  
ODT, (ODT0),  
(ODT1)  
Input  
Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.  
RAS,  
CAS, WE  
Input  
Input  
Input Data Mask: DM is an input mask signal for write data. Input data is masked when  
DM is sampled HIGH coincident with that input data during a Write access. DM is sampled  
on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS is enabled by  
Mode Register A11 setting in MR1.  
DM, (DMU),  
(DML)  
Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write or Precharge  
BA0 - BA2  
A0 - A15  
Input command is being applied. Bank address also determines if the mode register or extended  
mode register is to be accessed during a MRS cycle.  
Address Inputs: Provide the row address for Active commands and the column address for  
Read/Write commands to select one location out of the memory array in the respective  
bank. (A10/AP and A12/BC have additional functions, see below).  
Input  
The address inputs also provide the op-code during Mode Register Set commands.  
Auto-precharge: A10 is sampled during Read/Write commands to determine whether  
Autoprecharge should be performed to the accessed bank after the Read/Write operation.  
(HIGH: Autoprecharge; LOW: no Autoprecharge).A10 is sampled during a Precharge  
command to determine whether the Precharge applies to one bank (A10 LOW) or all  
banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank  
addresses.  
A10 / AP  
A12 / BC  
Input  
Burst Chop: A12 / BC is sampled during Read and Write commands to determine if burst  
Input chop (on-the-fly) will be performed.  
(HIGH, no burst chop; LOW: burst chopped). See command truth table for details.  
Rev. 1.4/ Oct. 2020  
7

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