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GBU6K PDF预览

GBU6K

更新时间: 2024-11-01 22:48:51
品牌 Logo 应用领域
WTE 整流二极管桥式整流二极管
页数 文件大小 规格书
3页 49K
描述
6.0A GLASS PASSIVATED BRIDGE RECTIFIER

GBU6K 数据手册

 浏览型号GBU6K的Datasheet PDF文件第2页浏览型号GBU6K的Datasheet PDF文件第3页 
WTE  
PO WER SEM ICONDUCTORS  
GBU6A – GBU6K  
6.0A GLASS PASSIVATED BRIDGE RECTIFIER  
Features  
!
Glass Passivated Die Construction  
A
!
!
!
!
!
Low Forward Voltage Drop  
High Current Capability  
High Reliability  
High Surge Current Capability  
Ideal for Printed Circuit Boards  
D
GBU  
J
Dim  
A
B
C
D
E
Min  
21.80  
18.30  
7.40  
3.50  
1.52  
2.16  
4.83  
1.65  
1.65  
0.76  
3.30  
17.50  
0.46  
Max  
22.30  
18.80  
7.90  
4.10  
2.03  
2.54  
5.33  
2.16  
2.03  
1.02  
3.56  
18.00  
0.56  
C
+
~
~
-
E
G
H
J
G
K
Mechanical Data  
!
!
H
Case: Molded Plastic  
K
L
Terminals: Plated Leads Solderable per  
MIL-STD-202, Method 208  
Polarity: As Marked on Body  
Weight: 4.0 grams (approx.)  
Mounting Position: Any  
M
M
N
P
!
!
!
!
B
All Dimensions in mm  
Marking: Type Number  
L
N
P
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified  
Single Phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
Characteristic  
Symbol GBU6A GBU6B GBU6D GBU6G GBU6J GBU6K Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
VRRM  
VRWM  
VR  
50  
35  
100  
70  
200  
140  
400  
280  
600  
420  
800  
560  
V
RMS Reverse Voltage  
VR(RMS)  
IO  
V
A
Average Rectified Output Current  
@TC = 100°C  
6.0  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine-wave superimposed on  
rated load (JEDEC Method)  
I
FSM  
175  
A
I2t Rating for Fusing (t < 8.35ms)  
I2t  
127  
1.0  
A2s  
V
Forward Voltage (per element)  
@IF = 6.0A  
VFM  
IR  
Peak Reverse Current  
At Rated DC Blocking Voltage  
@TA = 25°C  
@TC = 100°C  
5.0  
500  
µA  
Typical Thermal Resistance (per leg) (Note 1)  
Typical Thermal Resistance (per leg) (Note 2)  
Operating and Storage Temperature Range  
RJA  
RJC  
8.6  
3.1  
K/W  
K/W  
°C  
Tj, TSTG  
-55 to +150  
Note: 1. Thermal resistance junction to ambient, mounted on PCB at 9.5mm lead length with 12mm2 copper pads.  
2. Thermal resistance junction to case, mounted on 6.5 x 3.5 x 0.15cm thick AL plate.  
GBU6A – GBU6K  
1 of 3  
© 2002 Won-Top Electronics  

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