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FS225R12KE3 PDF预览

FS225R12KE3

更新时间: 2024-11-11 12:27:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管双极性晶体管局域网
页数 文件大小 规格书
9页 576K
描述
Technische Information / Technical Information

FS225R12KE3 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Not Recommended包装说明:FLANGE MOUNT, R-XUFM-X29
针数:29Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.67
Is Samacsys:N外壳连接:ISOLATED
最大集电极电流 (IC):325 A集电极-发射极最大电压:1200 V
配置:3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR门极-发射极最大电压:20 V
JESD-30 代码:R-XUFM-X29元件数量:6
端子数量:29最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):1100 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICON标称断开时间 (toff):810 ns
标称接通时间 (ton):400 nsVCEsat-Max:2.1 V
Base Number Matches:1

FS225R12KE3 数据手册

 浏览型号FS225R12KE3的Datasheet PDF文件第2页浏览型号FS225R12KE3的Datasheet PDF文件第3页浏览型号FS225R12KE3的Datasheet PDF文件第4页浏览型号FS225R12KE3的Datasheet PDF文件第5页浏览型号FS225R12KE3的Datasheet PDF文件第6页浏览型号FS225R12KE3的Datasheet PDF文件第7页 
TechnischeꢀInformationꢀ/ꢀTechnicalꢀInformation  
IGBT-Module  
IGBT-modules  
FS225R12KE3  
-ꢀEconoPACK™+ꢀModulꢀmitꢀTrench/FeldstopꢀIGBT3ꢀundꢀHighꢀEfficiencyꢀDiodeꢀ  
-ꢀEconoPACK™+ꢀwithꢀtrench/fieldstopꢀIGBT3ꢀandꢀEmConꢀHighꢀEfficiencyꢀdiodeꢀ  
IGBT,Wechselrichterꢀ/ꢀIGBT,Inverter  
HöchstzulässigeꢀWerteꢀ/ꢀMaximumꢀRatedꢀValues  
Kollektor-Emitter-Sperrspannung  
Collector-emitterꢀvoltage  
Tvj = 25°C  
VCES  
1200  
V
Kollektor-Dauergleichstrom  
ContinuousꢀDCꢀcollectorꢀcurrent  
TC = 80°C, Tvj = 150°C  
TC = 25°C, Tvj = 150°C  
IC nom  
IC  
225  
325  
A
A
PeriodischerꢀKollektor-Spitzenstrom  
Repetitiveꢀpeakꢀcollectorꢀcurrent  
tP = 1 ms  
ICRM  
Ptot  
450  
1150  
+/-20  
A
Gesamt-Verlustleistung  
Totalꢀpowerꢀdissipation  
TC = 25°C, Tvj = 150°C  
W  
Gate-Emitter-Spitzenspannung  
Gate-emitterꢀpeakꢀvoltage  
VGES  
V
CharakteristischeꢀWerteꢀ/ꢀCharacteristicꢀValues  
min. typ. max.  
Kollektor-Emitter-Sättigungsspannung  
Collector-emitterꢀsaturationꢀvoltage  
IC = 225 A, VGE = 15 V  
IC = 225 A, VGE = 15 V  
Tvj = 25°C  
Tvj = 125°C  
1,70 2,15  
2,00  
V
V
VCE sat  
VGEth  
QG  
Gate-Schwellenspannung  
Gateꢀthresholdꢀvoltage  
IC = 9,00 mA, VCE = VGE, Tvj = 25°C  
VGE = -15 V ... +15 V  
5,0  
5,8  
2,10  
3,3  
16,0  
0,75  
6,5  
V
µC  
Gateladung  
Gateꢀcharge  
InternerꢀGatewiderstand  
Internalꢀgateꢀresistor  
Tvj = 25°C  
RGint  
Cies  
Eingangskapazität  
Inputꢀcapacitance  
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V  
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V  
VCE = 1200 V, VGE = 0 V, Tvj = 25°C  
VCE = 0 V, VGE = 20 V, Tvj = 25°C  
nF  
nF  
Rückwirkungskapazität  
Reverseꢀtransferꢀcapacitance  
Cres  
ICES  
IGES  
td on  
Kollektor-Emitter-Reststrom  
Collector-emitterꢀcut-offꢀcurrent  
5,0 mA  
Gate-Emitter-Reststrom  
Gate-emitterꢀleakageꢀcurrent  
400 nA  
µs  
Einschaltverzögerungszeit,ꢀinduktiveꢀLast  
Turn-onꢀdelayꢀtime,ꢀinductiveꢀload  
IC = 225 A, VCE = 600 V  
VGE = ±15 V  
RGon = 3,3 Ω  
Tvj = 25°C  
Tvj = 125°C  
0,25  
0,30  
µs  
Anstiegszeit,ꢀinduktiveꢀLast  
Riseꢀtime,ꢀinductiveꢀload  
IC = 225 A, VCE = 600 V  
VGE = ±15 V  
RGon = 3,3 Ω  
Tvj = 25°C  
Tvj = 125°C  
0,09  
0,10  
µs  
µs  
tr  
td off  
tf  
Abschaltverzögerungszeit,ꢀinduktiveꢀLast  
Turn-offꢀdelayꢀtime,ꢀinductiveꢀload  
IC = 225 A, VCE = 600 V  
VGE = ±15 V  
RGoff = 3,3 Ω  
Tvj = 25°C  
Tvj = 125°C  
0,55  
0,65  
µs  
µs  
Fallzeit,ꢀinduktiveꢀLast  
Fallꢀtime,ꢀinductiveꢀload  
IC = 225 A, VCE = 600 V  
VGE = ±15 V  
RGoff = 3,3 Ω  
Tvj = 25°C  
Tvj = 125°C  
0,13  
0,16  
µs  
µs  
EinschaltverlustenergieꢀproꢀPuls  
Turn-onꢀenergyꢀlossꢀperꢀpulse  
IC = 225 A, VCE = 600 V, LS = 80 nH  
VGE = ±15 V  
RGon = 3,3 Ω  
Tvj = 25°C  
Tvj = 125°C  
mJ  
mJ  
Eon  
Eoff  
15,0  
36,0  
AbschaltverlustenergieꢀproꢀPuls  
Turn-offꢀenergyꢀlossꢀperꢀpulse  
IC = 225 A, VCE = 600 V, LS = 80 nH  
VGE = ±15 V  
RGoff = 3,3 Ω  
Tvj = 25°C  
Tvj = 125°C  
mJ  
mJ  
Kurzschlußverhalten  
SCꢀdata  
VGE 15 V, VCC = 900 V  
VCEmax = VCES -LsCE ·di/dt  
ISC  
tP 10 µs, Tvj = 125°C  
900  
A
Wärmewiderstand,ꢀChipꢀbisꢀGehäuse  
Thermalꢀresistance,ꢀjunctionꢀtoꢀcase  
proꢀIGBTꢀ/ꢀperꢀIGBT  
RthJC  
RthCH  
0,11 K/W  
K/W  
Wärmewiderstand,ꢀGehäuseꢀbisꢀKühlkörper proꢀIGBTꢀ/ꢀperꢀIGBT  
Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink  
0,047  
λPasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλgreaseꢀ=ꢀ1ꢀW/(m·K)  
preparedꢀby:ꢀMB  
approvedꢀby:ꢀWR  
dateꢀofꢀpublication:ꢀ2013-02-28  
revision:ꢀ3.1  
1

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